A high-speed eml coaxial launch assembly and its manufacturing method
A technology for transmitting components and manufacturing methods, applied in the field of optical communication, can solve problems such as exceeding the tolerance range of DWDM, and achieve the effect of low cost and easy mass production
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Embodiment 1
[0044] Embodiment 1 of the present invention provides a high-speed EML coaxial transmitting component, which is applied to a DWDM working temperature module. Such as figure 1 As shown, the high-speed EML coaxial emission assembly includes a TO base 1 , a TEC 2 , a ceramic substrate 3 , an EML chip 4 and a thermistor 5 . Optionally, the high-speed EML coaxial launch assembly further includes a mirror 6 . Wherein, whether it is necessary to set the reflector 6 is determined according to the selected EML placement method, whether to place the EML vertically or to place the EML horizontally. In the embodiment of the present invention, the structure with the reflector 6 and the EML placed horizontally will be described, but this Those skilled in the art can know that correspondingly, if the structure of placing the EML vertically is adopted, the corresponding reflector 6 is not needed; the above-mentioned several optional combinations are within the protection scope of the present...
Embodiment 2
[0059] Embodiment 2 of the present invention provides a manufacturing method of a high-speed EML coaxial emitting assembly, the high-speed EML coaxial emitting assembly is applied to a DWDM temperature module, and the manufacturing method is used to manufacture any one of the first embodiment of the present invention. A high-speed EML coaxial launch assembly, the specific steps of the manufacturing method are as follows Figure 11 shown.
[0060] Step S100: mounting the first surface of the TEC on the TO base, and mounting the EML chip on the ceramic substrate.
[0061] The TEC2 is mounted and solidified on the TO base 1 through a SnAgCu (217° C.) eutectic soldering process, and the first surface of the TEC2 is a welding surface. The EML chip 4 is mounted and solidified on the prefabricated gold-tin solder region 311 of the ceramic substrate 3 by AuSn (280° C.) eutectic bonding process, and then the wedge bonding wire 41 on the EML chip 4 is completed by an automatic wedge bo...
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