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High-speed EML coaxial transmission module and manufacturing method therefor

A technology for transmitting components and manufacturing methods, applied in the field of optical communication, can solve problems such as exceeding the tolerance range of DWDM, and achieve the effect of low cost and easy mass production

Active Publication Date: 2019-03-01
WUHAN TELECOMM DEVICES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The present invention provides a high-speed EML coaxial emission component and its manufacturing method. The technical problem to be solved by the present invention is that the variation of the wavelength of the existing coaxial packaged EML device in the high and low temperature range of the DWDM working temperature module exceeds the DWDM wavelength The problem of tolerance range

Method used

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  • High-speed EML coaxial transmission module and manufacturing method therefor
  • High-speed EML coaxial transmission module and manufacturing method therefor
  • High-speed EML coaxial transmission module and manufacturing method therefor

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Embodiment 1

[0044] Embodiment 1 of the present invention provides a high-speed EML coaxial transmitting component, which is applied to a DWDM working temperature module. like figure 1 As shown, the high-speed EML coaxial emission assembly includes a TO base 1 , a TEC 2 , a ceramic substrate 3 , an EML chip 4 and a thermistor 5 . Optionally, the high-speed EML coaxial launch assembly further includes a mirror 6 . Wherein, whether it is necessary to set the reflector 6 is determined according to the selected EML placement method, whether to place the EML vertically or to place the EML horizontally. In the embodiment of the present invention, the structure with the reflector 6 and the EML placed horizontally will be described, but this Those skilled in the art can know that correspondingly, if the structure of placing the EML vertically is adopted, the corresponding reflector 6 is not needed; the above-mentioned several optional combinations are within the protection scope of the present in...

Embodiment 2

[0059] Embodiment 2 of the present invention provides a manufacturing method of a high-speed EML coaxial emitting assembly, the high-speed EML coaxial emitting assembly is applied to a DWDM temperature module, and the manufacturing method is used to manufacture any one of the first embodiment of the present invention. A high-speed EML coaxial launch assembly, the specific steps of the manufacturing method are as follows Figure 11 shown.

[0060] Step S100: mounting the first surface of the TEC on the TO base, and mounting the EML chip on the ceramic substrate.

[0061] The TEC2 is mounted and solidified on the TO base 1 through a SnAgCu (217° C.) eutectic soldering process, and the first surface of the TEC2 is a welding surface. The EML chip 4 is mounted and solidified on the prefabricated gold-tin solder region 311 of the ceramic substrate 3 by AuSn (280° C.) eutectic bonding process, and then the wedge bonding wire 41 on the EML chip 4 is completed by an automatic wedge bo...

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Abstract

The invention discloses a high-speed EML coaxial transmission module and a manufacturing method therefor. The high-speed EML coaxial transmission module comprises a TO pedestal, a TEC, a ceramic substrate, an EML chip and a thermistor. The first surface of the TEC is disposed on the TO pedestal, and the ceramic substrate is disposed on a second surface of the TEC. The EML chip is disposed on the ceramic substrate, and the lower surface of the thermistor is fixed on the ceramic substrate and is close to the EML chip. The upper surface of the thermistor is electrically connected with a bonding pad of the ceramic substrate. The bonding pad of the ceramic substrate is electrically connected with a thermistor pin on the TO pedestal. The module can enable the temperatures of the upper and lowersurfaces of the thermistor to be consistent as much as possible under the high and low temperatures, thereby guaranteeing the DWDM wavelength stability under the high and low temperatures.

Description

【Technical field】 [0001] The invention relates to the technical field of optical communication, in particular to a high-speed EML coaxial transmitting component and a manufacturing method thereof. 【Background technique】 [0002] In the field of optical communication, an electroabsorption modulated laser (EML) is mainly used for long-distance transmission. High-speed EML lasers for 10G and 25G usually use BOX packaging, but the packaging cost is high, which is not conducive to mass production. In recent years, for the application of 5G communication network and optical transmission network, there is a strong demand for the development of 10G and 25G low-cost and low-power dense wavelength division multiplexing DWDM (Dense Wavelength Division Multiplexing, abbreviated as DWDM) working temperature modules. Therefore, it is very It is necessary to develop EML emission components with cooled coaxial packages that meet the requirements. [0003] To meet the requirements of low-p...

Claims

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Application Information

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IPC IPC(8): G02B6/42
CPCG02B6/4271G02B6/4274G02B6/4263H01S5/02212H01S5/02415H01S5/02476H01S5/0237H01S5/0612H01S5/0683H01S5/02325H01S5/02255
Inventor 阮扬刘成刚梅雪伍斌
Owner WUHAN TELECOMM DEVICES