High-thermal conductivity double-sided aluminum substrate and manufacturing method thereof

Abstract

The invention provides a high-thermal conductivity double-sided aluminum substrate and a manufacturing method thereof. The manufacturing method of the high-thermal conductivity double-sided aluminum substrate comprises the following steps of: S1: manufacturing a double-sided plate: firstly, placing a core plate between two copper foils and pressing, drilling the pressed double-sided plate, carrying out resin hole plugging on the drilled double-sided plate, carrying out resin grinding on the double-sided plate after being subjected to the resin hole plugging and carrying out acid etching on thedouble-sided plate to complete the manufacturing of the double-sided plate; S2: laminating: placing a polypropylene (PP) film between the manufactured double-sided plate and an aluminum substrate andpressing by utilizing a plate press to obtain a laminated plate; S3: carrying out depth-controlled drilling: carrying out depth-controlled drilling on the laminated plate obtained in the S2 by utilizing a depth-controlled drilling machine; and S4: carrying out copper paste hole plugging the hole: fully plugging the drill hole by using the copper paste in vacuum. The high-thermal conductivity double-sided aluminum substrate and the manufacturing method thereof, which are provided by the invention, have the advantages that the direct connection of an aluminum base and a circuit pattern is realized and the thermal conducting efficiency is high.

Description

technical field [0001] The invention relates to the technical field of double-sided aluminum substrates, in particular to a double-sided aluminum substrate with high thermal conductivity and a manufacturing method thereof. Background technique [0002] Double-sided aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. It consists of a unique five-layer structure, which are circuit layer (copper foil), core board, circuit layer (copper foil), thermal insulation layer and Metal base. Widely used in LED lighting, audio, power supply, communication electronics, office automation, automobiles, computers, power modules and other industries with high power and heat dissipation requirements. [0003] In the existing double-sided aluminum substrate, the thermally conductive insulating layer is the core technology of the double-sided aluminum substrate, which mainly plays the functions of bonding, insulation and heat conduction. The double-sid...

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Problems solved by technology

[0004] However, since the heat conduction function of the double-sided aluminum substrate is performed through the thermally conductive insulating layer, the thermal conductivity of the thermally conductive insulating layer determines the thermal conductivity of the double-sided aluminum substrate. Due to the limitation of the material composition and structure of the thermally conductive insulating layer, the current maximum thermal conductivity is 3W. / (m·K), and more and more high-power products currently on the market require heat to be dissipated quickly. If the heat cannot be dissipated quickly, electronic components will fail

Therefore, it is required that the thermal conductivity of the PCB board must be ≥ 100W / (m·K) to meet the heat dissipation requirements of its products, and the current thermal conductivity of double-sided aluminum substrates cannot meet the heat dissipation requirements of its products.

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