Ultrasonic excitation device loaded with high temperature environment as well as working method thereof

Abstract

The invention provides an ultrasonic excitation device loaded with a high temperature environment as well as a working method thereof, and the ultrasonic excitation device belongs to the technical field of micro electromechanical systems. The ultrasonic excitation device comprises a barrel, a base plate arranged at the bottom of the barrel, a microstructure excitation unit and a photoheating unit.The microstructure excitation unit comprises a first manual triaxial displacement platform and a second manual triaxial displacement platform, a second connecting plate is mounted on a vertical slidecarriage of the second manual triaxial displacement platform, and an ultrasonic probe is mounted in a through hole at the center of the bottom of the second connecting plate by virtue of a set screw.An anti-dazzling screen and a mask are used in the photoheating unit, so that parallel lights emitted by the photoheating unit only can be irradiated on an MEMS microstructure. The ultrasonic excitation device provided by the invention realizes simultaneous heating on the entirety of the MEMS microstructure, thereby guaranteeing uniform temperature distribution on the surface of the microstructure, reducing temperature gradient on the surface of the microstructure and greatly improving accuracy of dynamic characteristic parameter testing of the microstructure in the high temperature environment.

Description

technical field [0001] The invention relates to an ultrasonic excitation device loaded with a high-temperature environment and a working method thereof, belonging to the technical field of micromechanical electronics. Background technique [0002] Due to the characteristics of low cost, small size, light weight, high integration and high degree of intelligence, MEMS micro devices have been widely used in automobiles, aerospace, information communication, biochemistry, medical treatment, automatic control, consumer goods and national defense. fields have been widely applied. When designing and developing MEMS, because the system function is mainly realized by the micro-displacement and deformation of the microstructure, it is necessary to measure the dynamic performance of the micro-mechanical components, so the mechanical motion parameters of MEMS such as displacement, velocity, amplitude, frequency and vibration mode Accurate measurement has become an important part of the...

AI Technical Summary

Problems solved by technology

When the above-mentioned heat conduction heating method is used to heat the microstructure, since the heat energy is transferred to the microstructure through the microstructure substrate, the temperature field distribution on the microstructure is very uneven, and the temperature on the microstructure far away from the substrate To be lower than the temperature at the proximal end of the substrate, according to the research results of F. Shen et al. in "Thermal effects on coated resonant microcantilevers", when the temperature field distribution on the microstructure is not uniform, test the dynamic characteristics of the microstructure in a high temperature environment The accuracy of the parameters will be greatly reduced

Therefore, the way of using heat conduction to heat the microstructure in the prior art has great disadvantages

Images