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Graphite heat conducting plate filled with fluid material

A graphite heat conduction and flow material technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problems of mismatching thermal expansion coefficient of aluminum alloy and low strength of graphite heat conduction plate, and achieve thermal The effect of high efficiency and low thermal resistance

Inactive Publication Date: 2019-03-12
XIAN AVIATION COMPUTING TECH RES INST OF AVIATION IND CORP OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Purpose of the present invention: to solve the problem that the graphite heat conduction plate has low strength and does not match the thermal expansion coefficient of aluminum alloy

Method used

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  • Graphite heat conducting plate filled with fluid material

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Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0015] In the first step, lay a layer of fluid material in the cavity of the second metal frame. The filling height of the fluid material is consistent with the boss inside the cavity of the second metal frame in the figure or not higher than 0.1mm of the boss height. In order to reduce the thermal resistance of the fluid material, the height of the boss inside the cavity of the first metal frame is less than 1 mm, and the particle size of the fluid material is less than 0.1 mm.

[0016] In the second step, the graphite heat conduction plate is filled inside the second metal frame. The boss of the second metal frame can prevent the graphite heat conduction plate from biasing to one side of the second metal frame or the first metal frame;

[0017] The third step is to spread a layer of fluid material on the graphite heat conduction plate. The filling height of the fluid material is consistent with the boss inside the cavity of the first metal frame in the figure or not higher...

specific Embodiment approach 2

[0019] The first step is to fill the graphite heat conduction plate between the first metal frame and the second metal frame. The bosses on the first metal frame and the second metal frame can prevent the graphite heat conduction plate from biasing towards the first metal frame or the second metal frame side. In order to reduce the thermal resistance of the fluid material filled in the third step, the height of the boss inside the cavity of the first metal frame is less than 1 mm, and the particle size of the fluid material is less than 0.1 mm.

[0020] In the second step, the first metal frame and the second metal frame are connected by a mechanical connection method, and the mechanical connection method includes welding, bonding and other mechanical connection methods;

[0021] The third step is to fill the filling material into the gap between the first metal frame and the graphite heat conducting plate, the second metal frame and the graphite heat conducting plate from the...

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Abstract

A graphite heat conducting plate filled with a fluid material is provided. The graphite heat conducting plate filled with the fluid material comprises a first metal frame, a fluid filling material, agraphite heat conducting sheet, and a second metal frame. A fluid material with the thermal conductivity greater than 3 w / (mk) is filled between the graphite heat conducting sheet and the first and second frames. By using the technical scheme of the present invention, even if the temperature changes significantly, the two materials are tightly combined together by using the fluid material; due tothe high thermal conductivity of the selected fluid material, the thermal resistance between the graphite heat conducting sheet and the frame material is small; and the thermal conductivity of the entire graphite heat conducting plate cannot decrease due to the addition of the fluid material.

Description

technical field [0001] The invention belongs to the technical field of heat conduction structure design, and in particular relates to a graphite heat conduction plate filled with fluidity material. Background technique [0002] At present and for a long period of time in the future, convection cooling + conduction cooling is still the main way for airborne electronic equipment to dissipate heat. When this heat dissipation method is adopted, the heat of the electronic module is transmitted to the side wall of the chassis by conduction through the heat conducting plate of the module, and then the heat is carried to the outside of the chassis by the external cooling air. There are two main aspects that affect the heat dissipation effect of this heat dissipation method, namely, the thermal conductivity of the heat conduction plate and the heat exchange efficiency of the chassis. According to the relevant theory of heat transfer, for an electronic module with uniform heat distri...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20463
Inventor 杨明明赵亮董进喜赵航
Owner XIAN AVIATION COMPUTING TECH RES INST OF AVIATION IND CORP OF CHINA