Cooling unit, heat insulating structure, substrate processing apparatus, and manufacturing method of semiconductor device

Abstract

The present invention relates to a cooling unit, a heat insulating structure, a substrate processing apparatus, and a method of manufacturing a semiconductor device, and provides a structure that improves the responsiveness of heating and cooling control between regions. It is configured to include: a suction pipe provided in each area to supply gas for cooling the reaction tube; a control valve provided in the suction pipe to adjust the flow rate of the gas; and temporarily storing the gas supplied from the suction pipe. The buffer part that stays; And, be provided with the opening that the gas stored in the buffer part is blown toward the reaction tube, thus provide the flow rate of the gas introduced into the suction pipe by setting the length ratio of the up and down direction of the region, Therefore, the control valve is opened and closed to adjust the flow rate and flow velocity of the gas ejected from the opening toward the reaction tube.

Description

technical field [0001] The present invention relates to a cooling unit, a heat insulating structure, a substrate processing device, and a method of manufacturing a semiconductor device. Background technique [0002] A semiconductor manufacturing apparatus is known as an example of a substrate processing apparatus, and a vertical apparatus is known as an example of a semiconductor manufacturing apparatus. In the vertical apparatus, a wafer boat, which is a substrate holding unit that holds multiple substrates (hereinafter also referred to as wafers) in multiple layers, is carried into the processing chamber in the reaction tube with the substrates held, and the temperature is controlled in multiple regions. control, and process the substrate at a predetermined temperature. Conventionally, in the temperature control of the heater, the heater was turned off when the temperature was lowered, but in recent years, the cooling gas is supplied from the cooling mechanism, and the co...

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Problems solved by technology

However, in the above-mentioned cooling unit structure, the reaction tube cannot be cooled uniformly in the rapid cooling by controlling the flow rate of the cooling gas, so the cooling rate will vary with the change of the area, resulting in differences in the temperature change process between the areas.

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