Temperature control system of polishing disk

Abstract

The invention relates to the technical field of CMP polishing disk temperature control, in particular to a temperature control system of a polishing disk. The temperature control system of the polishing disk comprises a polishing disk body, a circulating waterway, a temperature detecting device and an adjusting and controlling device; the circulating waterway comprises a plurality of water feedingpipelines and water return pipelines, the multiple water feeding pipelines separately correspond to different areas of the polishing disk body, and the water feeding pipelines correspond to the waterreturn pipelines one to one and communicate with the water return pipelines; the temperature detecting device detects the water return temperature of the water return pipelines and the surface temperature of the polishing disk body; and the adjusting and controlling device receives a temperature signal detected by the temperature detecting device, and controls the temperature and flow of coolingwater supplied to the polishing disk body by the water feeding pipelines. According to the temperature control system of the polishing disk, different areas are separately arranged on the polishing disk body, the independent water feeding pipelines and the water return pipelines are arranged in the areas, the temperature of the water return pipelines in the areas is monitored, the water feeding temperature and low of the water feeding pipelines are controlled, adaptive temperature adjustment and control of different areas is realized, so that the polishing disk body is cooled uniformly, and the polishing quality of a wafer is guaranteed.

Description

technical field [0001] The invention relates to the technical field of CMP polishing disc temperature control, in particular to a polishing disc temperature control system. Background technique [0002] The polishing process of chemical mechanical polishing is realized by the relative motion between the wafer and the polishing pad on the polishing disc. During the polishing process, a large amount of heat will be generated due to the friction between the wafer and the polishing pad, and due to the polishing disc When rotating, the polishing disc has different linear speeds in different radius areas, so the heat generated in each area during wafer polishing is also different. An increase in temperature will cause deformation of the polishing disc, and the deformation of the polishing disc will be different at different temperatures. In addition, the change and unevenness of temperature also affect the chemical action in the polishing process, which in turn affects the polish...

AI Technical Summary

Problems solved by technology

[0004] The purpose of this application is to provide a polishing disc temperature control system to solve the technical problem that the single control waterway in the prior art cannot realize adaptive temperature regulation to different temperature regions, resulting in uneven cooling of the polishing disc and affecting the polishing quality

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