Memory cell structure of SRAM
A storage unit and active area technology, applied in the direction of electrical components, transistors, electric solid-state devices, etc., can solve the problems of reading and writing window limitations, achieve improved matching, good consistency, and eliminate mismatching of width and length Effect
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no. 1 example
[0082] like Image 6 Shown is the layout of the memory cell structure of the first embodiment of the present invention SRAM; as Figure 7 shown, is Image 6 Shown is the circuit diagram of the memory cell structure of the SRAM of the first embodiment of the present invention. In the memory cell structure of the SRAM of the first embodiment of the present invention, the first NMOS transistor 1, the second NMOS transistor 2, the first PMOS transistor 3, the first The two PMOS transistors 4, the third NMOS transistor 5, the fourth NMOS transistor 6, the fifth NMOS transistor 7 and the sixth NMOS transistor 8 are connected to form a memory cell structure.
[0083] The first NMOS transistor 1 and the second NMOS transistor 2 serve as two selection transistors, the first PMOS transistor 3 and the second PMOS transistor 4 serve as two pull-up transistors, and the third NMOS transistor 5 and the fourth NMOS transistor 6 as two pull-down transistors, and the fifth NMOS transistor 7 a...
no. 2 example
[0114] like Figure 9 shown, is Image 6 The circuit diagram of the storage unit structure of the SRAM shown in the second embodiment of the present invention, Image 6 The setting of the metal layer in is set according to the second embodiment of the present invention. In the second embodiment of the present invention, the third NMOS transistor 5 is formed by connecting more than two NMOS sub-transistors in parallel. The NMOS sub-transistors are connected in parallel to increase the pull-down current of the third NMOS transistor 5, thereby increasing the read disturbance window of the device.
[0115] The fourth NMOS transistor 6 is formed by connecting more than two NMOS sub-transistors in parallel, and the pull-down current of the fourth NMOS transistor 6 is increased by connecting multiple NMOS sub-transistors in parallel, thereby increasing the read disturbance window of the device.
[0116] Image 6 and Figure 9 Among them, the third NMOS transistor 5 is composed of...
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