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A conductive solution for preventing microelectronic components from sticking to chips and preparation method thereof

A technology of electronic components and conductive solutions, which is applied in the field of conductive solutions for preventing microelectronic components from sticking to chips and its preparation, can solve problems such as easy adhesion and scrapping, achieve simple preparation methods, low raw material costs, and ensure reliable functionality Effect

Active Publication Date: 2020-07-14
东莞美坚化工原料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For this reason, the embodiment of the present invention provides a conductive solution for preventing microelectronic components from sticking to the chip and its preparation method, so as to solve the problem that existing miniaturized electronic products are easily stuck and scrapped during electroplating

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A kind of preparation method of the conductive solution that prevents microelectronic components from sticking to the chip that this embodiment proposes comprises the following steps:

[0024] Step 1), weighing 5 parts of sulfuric acid, 5 parts of methanesulfonic acid, 5 parts of sulfamic acid, 1 part of citric acid, 1 part of acrylic acid, 1 part of boric acid, and 82 parts of pure water;

[0025] Step 2), add 41 parts of pure water into the stirring tank and start stirring, the stirring speed is 10-20r / min;

[0026] Step 3), add citric acid, boric acid, sulfamic acid, acrylic acid successively;

[0027] Step 4), slowly add methanesulfonic acid;

[0028] Step 5), slowly add sulfuric acid;

[0029] Step 6), stirring slowly for 1h, the stirring speed is 10-20r / min;

[0030] Step 7), add the remaining pure water and keep stirring for 2h.

Embodiment 2

[0032] A kind of preparation method of the conductive solution that prevents microelectronic components from sticking to the chip that this embodiment proposes comprises the following steps:

[0033] Step 1), weighing 3 parts of sulfuric acid, 3 parts of methanesulfonic acid, 3 parts of sulfamic acid, 3 parts of citric acid, 3 parts of acrylic acid, 3 parts of boric acid, 82 parts of pure water;

[0034] Step 2), add 41 parts of pure water into the stirring tank and start stirring, the stirring speed is 10-20r / min;

[0035] Step 3), add citric acid, boric acid, sulfamic acid, acrylic acid successively;

[0036] Step 4), slowly add methanesulfonic acid;

[0037] Step 5), slowly add sulfuric acid;

[0038] Step 6), stirring slowly for 1h, the stirring speed is 10-20r / min;

[0039] Step 7), add the remaining pure water and keep stirring for 2h.

Embodiment 3

[0041] A kind of preparation method of the conductive solution that prevents microelectronic components from sticking to the chip that this embodiment proposes comprises the following steps:

[0042] Step 1), weighing 10 parts of sulfuric acid, 10 parts of methanesulfonic acid, 10 parts of sulfamic acid, 1 part of citric acid, 1 part of acrylic acid, 1 part of boric acid, 67 parts of pure water;

[0043] Step 2), add 33.5 parts of pure water into the stirring tank and start stirring, the stirring speed is 10-20r / min;

[0044] Step 3), add citric acid, boric acid, sulfamic acid, acrylic acid successively;

[0045] Step 4), slowly add methanesulfonic acid;

[0046] Step 5), slowly add sulfuric acid;

[0047] Step 6), stirring slowly for 1h, the stirring speed is 10-20r / min;

[0048] Step 7), add the remaining pure water and keep stirring for 2h.

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PUM

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Abstract

The embodiment of the invention discloses a conducting solution capable of preventing piece bonding of a micro electronic component and a preparing method thereof. The conducting solution comprises, by weight part, 9 to 30 parts of strongly conductive acid, 2.5 to 15 parts of weak conductive acid, and 55 to 88.5 parts of pure water. The conducting solution has the strong electricity conductance, and can effectively prevent piece bonding of the micro electronic component during electroplating, reliable functionality of the electronic component can be ensured, the preparing method is simple, theraw material cost is low, and the method is economic and efficient.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of electronic electroplating, and in particular to a conductive solution for preventing microelectronic components from sticking to chips and a preparation method thereof. Background technique [0002] At present, under the development trend of miniaturization and the premise of maintaining reliable functionality, electronic products still need to be electrochemically plated with a metal tin layer to maintain solderability so that the subsequent process can be successfully soldered to the circuit board. However, miniaturization Electronic products such as chip-resistors, multi-layer ceramic capacitors and chip-inductors, etc., are easy to stick together during electroplating because of their small volume and surface area. Separation causes scrapping, and it is generally necessary to introduce a conductive solution during electroplating, and if the conductivity of the conductive solu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/00C25D3/30
CPCC25D3/00C25D3/30
Inventor 朱志豪冼永贤梁颖豪
Owner 东莞美坚化工原料有限公司