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Method for manufacturing LTCC substrate co-fired solder resist layer

A production method and technology of solder resist layer, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problem of affecting the adhesion of LTCC substrate film layer, substrate strength, increasing the complexity of LTCC substrate manufacturing, and high-precision solder resist Problems such as the difficulty of layer production, to achieve the effect of reducing the product process preparation process, improving the accuracy of solder mask and reliability of solder mask, and improving reliability

Inactive Publication Date: 2019-03-26
NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, unlike the uniformity of thick film circuit substrate size, LTCC substrates have the characteristics of inconsistent shrinkage during the co-firing stage. Generally, the shrinkage rate deviation is about ±3‰. Taking the LTCC substrate with a size of 50mm*50mm as an example, the substrate size deviation It is about ±0.15mm, and the position accuracy of the solder mask needs to be controlled within ±0.05mm, which brings certain difficulties to the production of high-precision solder mask
At the same time, in order to realize the function of the solder resist layer, after the solder resist layer of the LTCC substrate is printed, it needs to undergo another post-firing, but each post-firing will not only increase the complexity of the LTCC substrate manufacturing, but also affect the LTCC substrate. Film adhesion, substrate strength and other properties

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] S1: making solder resist paste;

[0022] S11: Take 15 pieces of 6-inch LTCC green porcelain slices, divide the green porcelain slices into smaller pieces and put them into the mortar body;

[0023] S12: Pour in 200ml of absolute ethanol and stir for 15 minutes with a stirring bar to fully dissolve the green ceramic sheet in absolute ethanol;

[0024] S13: When the liquid in the grinding body becomes viscous, put the grinding body in a fume hood, wait for the absolute ethanol to volatilize, add an organic carrier to grind for 2 hours, and make a solder resist slurry. It is formulated from oleyl alcohol, ethyl cellulose and conductive paste thinner;

[0025] S2: Make a screen plate for solder mask printing with a latex thickness of 10 um;

[0026] S3: In the substrate conductor printing stage, after the solder paste and conductor paste are printed, use the solder resist paste to perform multi-layer printing on the substrate surface, and after the solder resist paste is ...

Embodiment 2

[0029] S1: making solder resist paste;

[0030] S11: Take 15 pieces of 6-inch LTCC green ceramic sheets, divide the green ceramic sheets into smaller pieces and put them into the grinding body;

[0031] S12: Pour in 200ml of absolute ethanol, and stir for 20 minutes with a stirring rod, so that the green ceramic sheet is fully dissolved in absolute ethanol;

[0032] S13: When the liquid in the grinding body becomes viscous, put the grinding body in a fume hood, wait for the absolute ethanol to evaporate, add an organic carrier to grind for 3 hours, and make a solder resist slurry. It is formulated from oleyl alcohol, ethyl cellulose and conductive paste thinner;

[0033] S2: Make a screen plate for solder mask printing with a latex thickness of 15 um;

[0034] S3: In the substrate conductor printing stage, after the solder paste and conductor paste are printed, use the solder resist paste to perform multi-layer printing on the substrate surface, and after the solder resist p...

Embodiment 3

[0037] S1: making solder resist paste;

[0038] S11: Take 15 pieces of 6-foot LTCC green porcelain slices, divide the green porcelain slices into smaller pieces and put them into the grinding body;

[0039] S12: Pour in 200ml of absolute ethanol, and stir for 18 minutes with a stirring rod, so that the green ceramic sheet is fully dissolved in absolute ethanol;

[0040] S13: When the liquid in the grinding body becomes viscous, put the grinding body in a fume hood, wait for the absolute ethanol to evaporate, add an organic carrier to grind for 2.5 hours, and make a solder resist slurry. It is formulated from oleyl alcohol, ethyl cellulose and conductive paste thinner;

[0041] S2: Make a screen plate for printing solder mask with a latex thickness of 13 um;

[0042] S3: In the substrate conductor printing stage, after the solder paste and conductor paste are printed, use the solder resist paste to perform multi-layer printing on the substrate surface, and after the solder re...

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Abstract

The invention relates to a method for manufacturing an LTCC substrate co-fired solder resist layer. The method comprises the steps of (S1) making a solder resist slurry including a step of dividing araw ceramic sheet into pieces with small sizes and placing the pieces into a grinding body, a step of pouring anhydrous ethanol, stirring with a stirring rod such that the raw ceramic sheet is fully dissolved in the anhydrous ethanol, and a step of placing the grinding body in a suction cabinet when the liquid in the grinding body becomes viscous, adding an organic carrier for grinding after the anhydrous ethanol is evaporated to form a solder resist paste, (S2) making a screen plate for solder resist printing, (S3) performing substrate surface multi-layer hot-press lamination printing by using the solder resist paste after a paste to be soldered and a conductor paste are printed in a substrate conductor printing stage, and (S4) burning the printed substrate to closely bond the solder paste, the conductor paste and the solder resist paste to form an LTCC substrate. According to the method for manufacturing the LTCC substrate co-fired solder resist layer, the process preparation processof a product is reduced, and the solder resist precision and the solder resist reliability are improved.

Description

technical field [0001] The invention relates to the technical field of manufacturing low-temperature co-fired ceramic substrates for microelectronics, in particular to a method for manufacturing a co-fired solder resist layer on an LTCC substrate. Background technique [0002] In recent years, with the continuous development of microelectronic information technology, electronic machines are developing in the direction of miniaturization, portability, multi-function, and digitalization, which promotes the continuous development of electronic components in the direction of miniaturization, integration, and high frequency. . LTCC is low-temperature co-fired ceramics. It is made of low-temperature sintered ceramic powder into a green ceramic film tape, which is sliced, punched, filled, conductive tape printed, laminated, and hot-pressed at 850°C for one-time use. Sintered, in the high-density circuit that does not interfere with each other in three-dimensional space, the miniat...

Claims

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Application Information

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IPC IPC(8): H01L21/48
CPCH01L21/4807H01L21/4853
Inventor 王伟沐方清孙轼项玮董兆文
Owner NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC