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Micro device transfer apparatus, transfer system and transfer method

A micro-device transfer, micro-device technology, applied in semiconductor/solid-state device manufacturing, electrical components, conveyor objects, etc., can solve the problems of high error rate, low transfer efficiency of micro devices, etc., to achieve high transfer efficiency, low cost, Good transfer accuracy

Pending Publication Date: 2019-03-26
韩进龙
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Aiming at the problems of low micro-device transfer efficiency and high error rate in the prior art, the present invention provides a micro-device transfer device, a transfer system and a transfer method, which can realize mass transfer of micro-device with high efficiency and accuracy good rate

Method used

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  • Micro device transfer apparatus, transfer system and transfer method
  • Micro device transfer apparatus, transfer system and transfer method
  • Micro device transfer apparatus, transfer system and transfer method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] In order to solve the above problems, this program provides a transfer device for micro-devices designed using electric field transfer technology, such as figure 1 , 2 As shown, the micro-device transfer device includes a micro-device transfer box 201, a cleaning mechanism, and a switching mechanism. The micro-device 1 is set in the micro-device transfer box 201, and the inside bottom of the micro-device transfer box 201 is provided with a stirring device, which is a stirring rod 214 in this embodiment, but other forms of stirring devices can also be used.

[0066] The micro-device transfer box 201 transfers the micro-device 1 from the micro-device transfer box 201 to the induction device 202 of the conversion mechanism; the electric field induction transfer technology is used to transfer the micro-device 1; the induction device is a metal roller or an external connection through a belt A plurality of roller structures, metal rollers or belts are provided with a conduc...

Embodiment 2

[0082] Embodiment 2 is basically the same as Embodiment 1, except that the sensing device 202 corresponds to multiple micro-device transfer cassettes 201 at the same time, and the micro-device transfer cassettes 201 here may contain single-color or multi-color micro-device.

Embodiment 3

[0084] Embodiment 3 is basically the same as Embodiment 1 or 2, and also includes a supply wheel 213. The supply wheel 213 is arranged under the interior of the micro device transfer box 201, and is in close contact with the lower part of the transfer roller 211. The micro device 1 is pushed to the supply by stirring. Wheel 213, the supply wheel 213 pushes the micro device 1 to the transfer roller 211, the micro device 1 is placed in the box, and pushed to the transfer roller 211 after being stirred, the supply wheel 213 rubs against the transfer roller 211 so that the micro device 1 is adsorbed on the hole of the transfer roller 211 In the process, the micro-device 1 is scraped off the superfluous micro-device 1 adsorbed on the surface of the transfer roller 211 via a scraper, and the micro-light-emitting diode 1 is also pushed into the hole on the surface of the transfer roller 21, and the micro-device 1 is processed according to the hole on the surface of the transfer roller ...

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Abstract

The invention, which belongs to the field of electronic manufacturing, discloses a micro device transfer apparatus, transfer system and transfer method, thereby solving problems of low transfer efficiency and high error rate in the prior art. The invention provides a micro device transfer apparatus, transfer system and transfer method. The micro device transfer apparatus comprises a micro device transfer box, a conversion mechanism, and a cleaning mechanism. The micro device transfer box is used for storing a micro device and transferring the micro device to a sensing device of the conversionmechanism. The conversion mechanism includes the sensing device and a rotating writing wheel in opposite to the sensing device; the micro device is transferred by using an electric field inductive transfer technology; and the micro device arranged on the sensing device is transferred to a transfer substrate. The cleaning mechanism is used for recycling micro devices that are not transferred on thesensing device. The massive transferring of micro devices is realized by using the electric field inductive transfer technology. The massive transferring of micro devices is realized with high efficiency and accuracy.

Description

technical field [0001] The invention relates to the technical field of electronic production, more specifically, to a transfer device, a transfer system and a transfer method for micro devices. Background technique [0002] Micro-devices are small in size and high in precision. The transfer and assembly of existing micro-devices are mainly carried out by means of adsorption, such as vacuum system adsorption for transfer, etc., but the transfer efficiency is low and the cost is high. For micro-devices such as micro-luminescence Diodes, or other electronic microdevices. [0003] With the advancement of optoelectronic technology, the volume of many optoelectronic components has gradually been miniaturized. In recent years, various micro-display technologies have been introduced successively. Among them, due to the breakthrough in the size of light-emitting diodes (LEDs), micro-light-emitting diodes, which are made of light-emitting diodes arranged in arrays, that is, Micro-LED...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/683
CPCH01L21/67703H01L21/6831H01L21/6833
Inventor 韩进龙
Owner 韩进龙
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