Silicon wafer automatic coating source production line

Abstract

The invention provides a silicon wafer automatic coating source production line. The silicon wafer automatic coating source production line comprises a boron coating device, a first drying furnace, aphosphorus coating device, a second drying furnace and a powder spraying unit, first transfer manipulators are arranged between the boron coating device and the first drying furnace, between the firstdrying furnace and the phosphorus coating device, between the phosphorus coating device and the second drying furnace and between the second drying furnace and the powder spraying unit, and one end of the downstream of the first drying furnace is provided with a silicon wafer turnover mechanism. The silicon wafer automatic coating source production line is high in automatic degree, multiple processes of the silicon wafer coating sources are automatically performed with no need for equipping with a lot of special manual operation, the failure rate is low, the coating efficiency is high, the coating is uniform, and the product qualification rate is high.

Description

technical field [0001] The invention belongs to the field of silicon wafer production equipment, and in particular relates to an automatic coating source production line for silicon wafers. Background technique [0002] With the rapid development of the semiconductor industry, the production capacity of semiconductor silicon wafers is expanding day by day. In the process of semiconductor silicon wafer production, it is necessary to coat the diffusion source on the silicon wafer to form a PN junction. However, in the prior art, manual coating is often used to complete the process. Since the production of silicon wafers involves a variety of work processes, resulting in product Efficiency and quality need to be improved. At present, there are manual coating operation methods: high error rate in manual operation; special personnel are required to operate; manual coating efficiency is low. Therefore, in order to solve the uneven quality of coating caused by manual coating The p...

AI Technical Summary

Problems solved by technology

In the process of semiconductor silicon wafer production, it is necessary to coat the diffusion source on the silicon wafer to form a PN junction. However, in the prior art, manual coating is often used to complete the process. Since the production of silicon wafers involves a variety of work processes, resulting in product Efficiency and quality need to be improved. At present, there are manual coating operation methods: high error rate in manual operation; special personnel are required to operate; manual coating efficiency is low. Therefore, in order to solve the uneven quality of coating caused by manual coating The problem is that an automatic equipment is needed to realize the automatic coating function of circular silicon wafers, so that the silicon wafers can be evenly coated, avoiding unqualified products caused by personnel problems, and achieving stable and efficient output

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