Heat sink for power device and air conditioner

A technology of power devices and heat dissipation devices, applied in the field of air conditioners, can solve problems such as restrictions on heat dissipation measures

Pending Publication Date: 2019-04-02
GD MIDEA AIR-CONDITIONING EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

With the development trend of miniaturization, the compact space design makes the control panel in a completely closed or semi-closed structure, coupled with the diversity of air conditioner use environments, these two heat dissipation measures are subject to certain restrictions

Method used

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  • Heat sink for power device and air conditioner
  • Heat sink for power device and air conditioner
  • Heat sink for power device and air conditioner

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Embodiment Construction

[0038] In order to understand the above-mentioned aspects, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0039] In the following description, many specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, therefore, the protection scope of the present invention is not limited to the specific details disclosed below. EXAMPLE LIMITATIONS.

[0040] The embodiment of the first aspect of the present invention proposes a heat dissipation device for a power device, which is used in an air conditioner, figure 1 A schematic block diagram showing t...

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Abstract

The present invention provides a heat sink for a power device of an air conditioner and an air conditioner. The heat sink comprises: a semiconductor refrigerating sheet, wherein the power device and the cold surface of the semiconductor refrigerating sheet are in contact with each other; a DC power source electrically connected to the semiconductor refrigerating sheet for supplying power to the semiconductor refrigerating sheet; and a control module for controlling the size of an input current to the semiconductor refrigerating sheet by the DC power source according to the size of the workingcurrent of the internal portion of the semiconductor refrigerating sheet to control the cold surface temperature of the semiconductor refrigerating sheet so as to control the working temperature of the power device. The heat sink of the power device solves the defect that the heat radiation of the heating devices cannot be met in a condition that the appearance structure of the air conditioner controller is limited, the provided semiconductor refrigerating and cooling technology is employed to better solve the heat radiation problem of the power device with no need for installation of a temperature detection device so as to ensure the service life of key power devices and improve the reliability and the operation quality of the controller on the premise of saving the cost.

Description

technical field [0001] The present invention relates to the technical field of air conditioners, and in particular, to a heat dissipation device of a power device and an air conditioner. Background technique [0002] In the electrical control system of air conditioners, the use of power devices and power electronic devices, especially inverter air conditioners, is inseparable. High-current and high-power devices such as thyristors, rectifier bridges, PFC circuit IGBTs and fast recovery FRDs, compressor inverter control IPM modules, and DC fan control modules will generate heat during operation, which needs to be considered. cooling measures. Whether the heat dissipation form of the air conditioning control system is good will directly affect the operation performance of the core power devices, and the reliability of the power devices determines the quality of the air conditioner. At present, the air-cooled form and refrigerant tube (water-cooled) heat dissipation are the m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M1/00H01L23/38
CPCH01L23/38H02M1/00
Inventor 吴思朗
Owner GD MIDEA AIR-CONDITIONING EQUIP CO LTD
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