A bonded gold wire cleaning device

Abstract

The invention discloses a bonding gold wire cleaning device. The bonding gold wire cleaning device comprises a cleaning device body, a supporting frame, a power supply device, a control panel, a controller, a wire cutting knife, a water collecting tank, a second supporting frame, an water inlet pipe, an ultrasonic generator, a purifying and cleaning tank and a wire-winding device. A gold wire penetrates through a wire-winding wheel assembly to bypass a third wire-winding wheel assembly, bypasses a second wire-winding wheel assembly to bypass the third wire-winding assembly again, then bypassestwo wire-winding wheels in the middle of the wire-winding wheel assembly from the third wire-winding wheel assembly, then bypasses a wire-winding wheel at the front end inside the third wire-windingwheel assembly again, then passes through the second wire-winding wheel assembly to bypass a wire-winding wheel at the rear end of the third wire-winding wheel assembly and passes through the wire-winding wheel at the rear end in a rotating wheel and the middle of a wire cutter to arrive at an external wire winder, the number of the wire-winding wheel assemblies is large, the wire-winding wheel assemblies are far away from each other, complete cleaning of the gold wire is facilitated, and the problem that the distance that the gold wire bypasses the cleaning tank is short, the penetrating speed is high, and consequently the cleaning efficiency is lowered is avoided.

Description

technical field [0001] The invention relates to the related field of cleaning devices, in particular to a bonded gold wire cleaning device. Background technique [0002] Bonding gold wire is a gold alloy wire used as a connecting wire in integrated circuits, also known as ball bonding gold wire or lead gold wire. There are three types of γ-type, C-type and FA-type. The latter two are used for high-speed bonding. Because beryllium, copper, silver, etc. have the functions of refining grains, increasing recrystallization temperature and strengthening gold, after the processing is completed, there is too much dust adhered to the surface of the gold wire, which often needs to be cleaned. The cleaning box of the ordinary cleaning device is small, and the gold The distance of the wire around the winding wheel is short, the cleaning efficiency of the gold wire is low, and the low cleaning rate leads to a decline in the quality of the bonding process. Therefore, a powerful alloy wire...

AI Technical Summary

Problems solved by technology

[0004] 1. In the existing bonded gold wire cleaning device, the distance for the gold wire to bypass the cleaning box during the cleaning process is short, and the passing speed is fast, resulting in a reduction in the cleaning efficiency of the gold wire

[0005] 2. In the existing bonded gold wire cleaning device, the water source of the factory is usually treated water, and the water source is not completely filtered and clean, resulting in many impurities particles adhering to the surface of the gold wire after cleaning

[0006] 3. In the existing bonded gold wire cleaning device, the built-in runner of the winding wheel is usually made of hard metal, and the gold wire is often easy to wear on the surface of the gold wire during transmission.

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