TO packaging-based semiconductor laser and packaging method thereof

Abstract

The invention belongs to the technical field of laser manufacturing, and aims to provide a TO packaging-based semiconductor laser and a packaging method thereof. The semiconductor laser comprises a base cylinder, a focusing assembly, a packaging rear cylinder and a TO packaging assembly comprising a light-emitting assembly; in the axial direction of the base cylinder, a mounting groove is formed in an inserting-connecting portion of the base cylinder; a coupling part is provided with a light outlet hole which is communicated with the mounting groove and is connected with an optical fiber in aninserted mode; and the light beam emitted by the light emitting assembly is focused by the focusing assembly and then can be coupled into the optical fiber to be output from the light outlet hole. During packaging, the focusing assembly is firstly inserted into the mounting groove from the axial direction and is limited on the base cylinder in the circumferential direction, and then the TO packaging assembly is inserted into a positioning cylinder of the focusing assembly and is limited on the positioning cylinder in the circumferential direction; finally, the packaging rear cylinder sleevesthe inserting-connecting portion of the base cylinder in the axial direction and is in spiral connection with the inserting-connecting portion of the base cylinder, so that the focusing assembly and the light-emitting assembly are packaged in the mounting groove of the base cylinder; and therefore, the packaging process is simple, the interchangeability of materials is high, the rejection rate islow, and the reliability is high.

Description

Technical field [0001] The invention belongs to the technical field of laser manufacturing, and more specifically, relates to a semiconductor laser based on TO packaging and a packaging method thereof. Background technique [0002] With the continuous development of science and technology, packaging technologies for semiconductor lasers include butterfly packaging and TO packaging. Among them, TO (Transistor Outline, originally defined as a transistor case) package refers to a coaxial package, which belongs to a fully enclosed package. It is widely used in optoelectronics due to its simple manufacturing process, low production cost, and ease of use. Devices such as laser diode packages. However, the existing manufacturing process of TO packaged semiconductor lasers is often complicated, and requires high professional skills of production personnel. In addition, when the device is repaired, the material reutilization rate is low, and the interchangeability of the original parts ...

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a semiconductor laser based on TO packaging, which is used to solve the problem of low material reutilization rate and poor interchangeability of original parts of TO packaging semiconductor lasers in the prior art, resulting in poor final reliability. Technical issues with high and high cost of use

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