MEMS process-based high-Q value three-dimensional spiral structure inductor and fabrication method thereof

Abstract

The invention belongs to the technical field of microelectronics, and particularly relates to an MEMS process-based high-Q value three-dimensional spiral structure inductor and a fabrication method thereof. The three-dimensional spiral structure integrated inductor comprises a silicon matrix, a substrate insulation layer, spiral coils and a spiral coil support object, wherein the substrate insulation layer is used for isolating inductance spiral coils from the silicon matrix, and the spiral coils form electrical connection by cylindrical metal in inter-coil insulation layers. A three-dimensional vertical integrated scheme is employed, the inductor and the silicon substrate are isolated by a basic insulation layer, and the substrate loss is reduced; a vertical spiral structure is supportedby an insulation material and is upwards and vertically integrated to form a multi-layer coil within relatively small area, and a miniature integrated inductor which is low in loss and small I stray parasitic capacitance, has high-Q value and mechanical stability and is simultaneously compatible with a package process is finally formed.

Description

technical field [0001] The invention belongs to the technical field of microelectronics, and in particular relates to a high-Q value three-dimensional spiral structure inductor and a manufacturing method thereof. Background technique [0002] In the past 30 years, with the development of electronic communication technology and the increasing functions of handheld devices such as smart consumer electronics, inductors, as one of the key components, have been widely used in integrated circuits to play the role of matching network, filtering, energy storage, choke And so on. Due to the constraints of packaging cost, size and performance conditions, traditional discrete inductors can no longer meet the growing demand. The demand for inductors with low energy consumption, small size, low noise, and high frequency continues to increase. [0003] Integrated inductors are usually realized in the form of metal spirals. Different designs and improvements of integrated inductors can be...

AI Technical Summary

Problems solved by technology

[0005] However, the above-mentioned methods have various problems such as process complexity, inconvenient IC compatible integration, difficulty in subsequent packaging, insufficient mechanical stability, high process cost and difficulty, etc.

Images