Seed treatment method for neat seedling emergence of euscaphis japonica seeds
A technology of seed treatment and wild jasmine, applied in the field of economic forest or ornamental plant seedling raising, can solve the problems of poor controllability of sowing time, not orderly, long treatment time, etc., to overcome deep dormancy, break shell neatly, and have good controllability Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0013] Take the harvested, impurity-removed, and selected Arvenia japonica seeds in the same year, and use a wooden box to put river sand with a moisture content of 5% and a thickness of about 10 cm. Then sprinkle a layer of seeds about 2cm thick, and then sprinkle a layer of river sand about 5cm thick, and hide the seeds sequentially, with the top layer being river sand. The stacking height should not exceed 50cm; after 300 days, mix in 0.5-1% plant ash and mix evenly. The humidity should be able to form a ball when kneading by hand. Cover with plastic cloth and keep warm for 15-20 days. Keep the temperature at 25°C~00°C until 350-360 days before the seeds start to crack. When the number of cracks reaches 3%-5%, sieve out the seeds and sow.
Embodiment 2
[0015] As in Example 1, before sowing, the uncracked seeds were sterilized and soaked in warm water at 50° C. to 60° C. for 24 hours, then fished out and sown.
Embodiment 3
[0017] As in Example 1, the seeds are sieved out, soaked with 0.5% potassium permanganate solution for 2 hours, removed and sealed for 30 minutes, rinsed with clear water and dried in the shade; or soaked with 0.5% to 1% ferrous sulfate solution for 2 hours, removed Rinse with clean water, dry in the shade and wait for sowing.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com