Glass substrate full-automatic cutting device and method

A glass substrate and cutting equipment technology, applied in glass manufacturing equipment, glass cutting devices, manufacturing tools, etc., can solve the problems of reduced work efficiency, poor cutting effect, incomplete removal of cutting platform debris, etc., to prevent static electricity, cost-saving effect

Pending Publication Date: 2019-04-12
JIANGSU HONGXIN YITAI INTELLIGENT EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problems in the prior art such as poor cutting effect caused by thickness differences between glass substrates, incomplete removal of debris on the cutting platform, and reduced work efficiency ca

Method used

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  • Glass substrate full-automatic cutting device and method
  • Glass substrate full-automatic cutting device and method
  • Glass substrate full-automatic cutting device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0148] Using the glass substrate automatic cutting equipment shown in Figure 1-9, the glass substrate 4 to be cut is a scrapped rectangular glass substrate.

[0149] The cutting platform 2 is a rectangular marble platform. The size of the cutting platform 2 is slightly larger than that of the glass substrate 4 to be cut. The cutting track is cross-shaped. According to the cutting track, the cutting platform 2 is divided into four equal parts ABCD. The pin holes 27 are on the cutting platform 2. Distributed in a row parallel to one side of the marble platform, the pin holes 27 on each adjacent two areas are distributed symmetrically with respect to the cutting track in the middle of these two areas, the pins 1 of the lifting device 34 and the pins on the cutting platform 2 The foot holes 27 are arranged correspondingly, so that when the glass substrate 4 falls on the rising pin 1 , the force is uniformly applied everywhere. The adsorption holes 28 are arranged avoiding the pin ...

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PUM

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Abstract

Provided is a glass substrate full-automatic cutting device. The device comprises a cutting platform, a lifting device, a cutting device and an adsorption transplanting device, and the cutting platform is used for carrying a glass substrate to be cut; the lifting device is used for transporting the glass substrate and capable of being docked with the cutting platform, thereby moving the glass substrate onto the cutting platform and receiving glass by the cutting platform; the cutting device is used for cutting the glass substrate on the cutting platform; the adsorption transplanting device isused for adsorbing the cut glass substrate, and the cut glass substrate is removed from the cutting platform in a predetermined order. A glass substrate full-automatic cutting method is also disclosed, and the method comprises the steps of placing the glass substrate to be cut on the cutting platform by using the lifting device, moving the cutting device along a cutting track to cut the glass substrate according to the cutting track, and using the adsorption transplanting device to adsorb the cut glass substrate which is then removed from the cutting platform in the predetermined order.

Description

technical field [0001] The invention relates to the field of liquid crystal display panel manufacturing, and more specifically, relates to a glass substrate automatic cutting device and method. Background technique [0002] Currently, the glass substrates of OLED, Array, TSP&BP segments need to be cut, sampled and scrapped. During the cutting process, since there may be thickness differences between each glass substrate to be cut, the cutting effect will be poor. And the cutting process is accompanied by debris. If the foreign matter on the cutting platform is not cleaned, when the cutting process is performed on the flat plate on the cutting platform, the part of the glass substrate corresponding to the foreign matter will be lifted and the substrate will not be placed flat, resulting in the substrate Inaccurate positioning or even fragments during the cutting process will cause inconvenience to sampling after cutting. Therefore, for the current cutting platform, debris on...

Claims

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Application Information

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IPC IPC(8): C03B33/03
CPCC03B33/03
Inventor 丁力程常宝
Owner JIANGSU HONGXIN YITAI INTELLIGENT EQUIP CO LTD
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