Thin-film battery preparation device and method
A technology for thin-film batteries and preparation devices, which is applied in vacuum evaporation plating, coating, sputtering plating, etc., can solve the problems of low battery purity, interruption of production process, long production cycle, etc., so as to improve the purity and reduce the variety , the effect of shortening the production cycle
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Embodiment 1
[0053] see figure 1 , as a specific embodiment of the thin film battery preparation device provided by the present invention, the sputtering vacuum chamber 11a and the number of evaporation vacuum chambers 12a are all one; there are five sputtering targets 010 in the sputtering vacuum chamber 11a, five A sputtering target 010 is respectively used to deposit the first protection layer 023, the cathode current collector layer 024, the cathode layer 025, the electrolyte layer 026 and the second protection layer 029; there are two evaporation targets 010 in the evaporation vacuum chamber 12a, The evaporation target 010 is used to deposit the cathode layer 025 and the cathode current collector layer 024 respectively. When the materials of the first protective layer 023 and the second protective layer 029 are the same, only four sputtering targets 010 can be set in the sputtering vacuum chamber 11a. The same sputtering target 010. Specifically, after the first protective layer 023...
Embodiment 2
[0055] see figure 2, as a specific embodiment of the thin-film battery preparation device provided by the present invention, the number of sputtering vacuum chambers is five, and the five sputtering vacuum chambers are respectively the first sputtering vacuum chambers for depositing the first protective layer 023 111. The second sputtering vacuum chamber 112 for depositing the cathode current collecting layer 024, the third sputtering vacuum chamber 113 for depositing the cathode layer 025, the fourth sputtering vacuum chamber 114 for depositing the electrolyte layer 026, and In the fifth sputtering vacuum chamber 115 for depositing the second protective layer 029, the number of evaporation vacuum chambers is two, and the two evaporation vacuum chambers are respectively the first evaporation vacuum chamber 121 for depositing the anode layer 027, The second evaporation vacuum chamber 122 for depositing the anode current collecting layer 028; the first sputtering vacuum chamber...
Embodiment 3
[0057] see image 3 , as a specific embodiment of the thin-film battery preparation device provided by the present invention, the number of sputtering vacuum chambers is five, and the five sputtering vacuum chambers are respectively the first sputtering vacuum chambers for depositing the first protective layer 023 111. The second sputtering vacuum chamber 112 for depositing the cathode current collecting layer 024, the third sputtering vacuum chamber 113 for depositing the cathode layer 025, the fourth sputtering vacuum chamber 114 for depositing the electrolyte layer 026, and In the fifth sputtering vacuum chamber 115 for depositing the second protective layer 029, the number of the evaporation vacuum chamber 12a is one, and the evaporation vacuum chamber 12a is used for depositing the anode layer 027 and the anode current collector layer 028; The chamber 111, the second sputtering vacuum chamber 112, the third sputtering vacuum chamber 113, the fourth sputtering vacuum chamb...
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