A kind of packaging material and its application

A packaging layer and chip packaging technology, applied in circuits, electrical solid devices, semiconductor devices, etc., can solve the problem of reducing the flexibility of silicone rubber, and achieve the effect of reducing thermal stress, excellent thermal conductivity and flexibility

Active Publication Date: 2021-05-18
SHENZHEN GRADUATE SCHOOL TSINGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, Sebnem Kemaloglu and others pointed out that 50% filling of micron-sized flake boron nitride in silicone rubber can increase the thermal conductivity of the material by ten times. However, as the filling increases, the flexibility of silicone rubber will gradually decrease.

Method used

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  • A kind of packaging material and its application
  • A kind of packaging material and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] see figure 1 , the present embodiment provides a packaging material, including a flexible packaging layer 1, an intermediate packaging layer 2 and a high-strength packaging layer 3 stacked in sequence, the flexible packaging layer includes a thermoplastic polymer and 10wt% thermally conductive filler, the middle packaging layer Including thermoplastic resin, the high-strength encapsulation layer includes high-strength material and 10wt% thermally conductive filler, the high-strength material is used to provide physical protection for the packaged object, the thermoplastic polymer used in this embodiment is butyl rubber, thermally conductive filler It is hexagonal boron nitride fiber, the thermoplastic resin is polyethylene, and the high-strength material is epoxy resin.

[0023] This embodiment also provides a method for preparing the above-mentioned packaging material by 3D printing, including the following steps:

[0024] (1) Establish a model of the packaging struct...

Embodiment 2

[0030] This embodiment provides a packaging material, including a flexible packaging layer, an intermediate packaging layer and a high-strength packaging layer stacked in sequence, the flexible packaging layer includes a thermoplastic polymer and 90wt% thermally conductive filler, and the thermoplastic polymer is silicone rubber The thermoplastic polymer phenyl vinyl silicone rubber, the thermally conductive filler is carbon fiber, the intermediate packaging layer includes thermoplastic resin, the thermoplastic resin is polyvinyl chloride, and the high-strength packaging layer includes high-strength material and 10wt% thermally conductive filler, so The high-strength material is polylactic acid, the thermally conductive filler is graphene fiber, and the high-strength material is used to provide physical protection for the packaged object.

Embodiment 3

[0032] This embodiment provides a packaging material, including a flexible packaging layer, an intermediate packaging layer and a high-strength packaging layer stacked in sequence, the flexible packaging layer includes a thermoplastic polymer and 20wt% thermally conductive filler, and the thermoplastic polymer is polydimethyl Silicone-based PDMS, the thermally conductive filler is aluminum nitride, the intermediate packaging layer includes thermoplastic resin, the thermoplastic resin is polyvinyl chloride, the high-strength packaging layer includes high-strength materials and 90wt% thermally conductive filler, the high The strength material is polylactic acid, the heat-conducting filler is silicon carbide, and the high-strength material is used to provide physical protection for the encapsulated object.

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Abstract

The invention discloses an encapsulation material and its application. The encapsulation material comprises a flexible encapsulation layer, an intermediate encapsulation layer and a high-strength encapsulation layer laminated in sequence, the flexible encapsulation layer includes a thermoplastic polymer and a heat-conducting filler, and the intermediate encapsulation layer Including thermoplastic resin, the high-strength encapsulation layer includes high-strength material and thermally conductive filler, and the high-strength material is used to provide physical protection for the encapsulated object. The packaging material of the present invention is suitable for 3D printing, has excellent thermal conductivity and flexibility, and has good application prospects in the direction of chip packaging.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a packaging material and its application. Background technique [0002] In the electronics industry, as the overall size of electronic devices becomes smaller and smaller, packaged electronic components operate at high frequencies to generate more heat. Since the heat will reduce the working efficiency and shorten the service life of the components, in order to ensure the effective operation of the components, it is necessary to dissipate heat in a timely and effective manner. [0003] At present, the heat dissipation of the chip mainly depends on the packaging of the chip to dissipate the heat, from the first-level packaging to the second-level packaging through the thermal interface material, and then from the thermal interface material to the third-level packaging. The primary packaging is the material closest to the heat source of the chip, which is the key to heat dissipa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/29H01L23/373C08L23/22C08L63/00C08L83/07C08L67/04C08K7/04C08K7/06C08L83/04C08K3/28C08K3/34
CPCC08K3/28C08K3/34C08K7/04C08K7/06C08K2003/282H01L23/295H01L23/3737C08L23/22C08L63/00C08L83/04C08L67/04H01L2224/73253
Inventor 康飞宇祝渊刘佳曼孙琪
Owner SHENZHEN GRADUATE SCHOOL TSINGHUA UNIV
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