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Light emitting assembly and packaging method thereof

A light-emitting component and silicon photonics technology, applied in the field of optical communication, can solve the problems of poor packaging versatility, etc., and achieve the effects of good airtightness, strong versatility, and low cost

Inactive Publication Date: 2019-04-16
WUHAN TELECOMM DEVICES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a light-emitting component and a packaging method thereof, which are used to solve the problem of poor versatility in the packaging of existing light-emitting components based on silicon photonics devices

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  • Light emitting assembly and packaging method thereof
  • Light emitting assembly and packaging method thereof
  • Light emitting assembly and packaging method thereof

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Embodiment Construction

[0030] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0031] figure 1 Schematic diagram of the structure of the light emitting component provided for the embodiment of the present invention, such as figure 1 As shown, a light emitting component includes a laser 101, a silicon light modulator 102, a TO base 103 and a TO lens cap 104; where the laser 101 and the silicon light modulator 102 are install...

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Abstract

The embodiment of the invention provides a light emitting assembly and a packaging method thereof. The light emitting assembly comprises a laser, a silicon optical modulator, a TO base and a TO lens cap, wherein the laser and the silicon optical modulator are arranged on the TO base, the TO lens cap is packaged on the TO base, a laser signal emitted by the laser is modulated through the silicon optical modulator and then is output through a light-transmitting part of the TO lens cap. According to the light emitting assembly and the packaging method thereof provided by the embodiment, the laserand the silicon optical modulator are subjected to TO packaging, the air tightness is good, reliability is high, universality is high, the cost is low, the assembly and the method are more suitable for mass production, the application and popularization of the light emitting assembly based on the silicon optical modulator.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of optical communication, and in particular, to an optical emitting component and a packaging method thereof. Background technique [0002] In recent years, with the in-depth development of silicon-based photonics, based on the SOI (Silicon-on-insulator, silicon-on-insulator) platform, people not only successfully fabricated passive devices such as optical waveguides, couplers, and beam splitters, but also fabricated A silicon optical modulator with outstanding performance has been developed. [0003] The modulator is the core device in the optical transceiver module, which is used to modulate the amplitude, frequency or phase of the optical carrier at the transmitting end. Due to the advantages of fast response speed, low power consumption, and high integration, silicon optical modulators have developed rapidly in recent years. At present, silicon optical modulators mainly have two m...

Claims

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Application Information

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IPC IPC(8): G02B6/42H04B10/50H04B10/516
CPCG02B6/4201H04B10/503H04B10/516
Inventor 杜巍梁雪瑞宋琼辉
Owner WUHAN TELECOMM DEVICES