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Method and device for terminal heat dissipation control, and storage medium

A control method and technology of a control device, which are applied in cooling/ventilation/heating modification, modification with gaseous coolant, electrical components, etc., can solve the problems of poor heat dissipation capacity and high operating temperature of terminal system chips, and improve convection heat dissipation capacity. , the effect of reducing the working temperature

Inactive Publication Date: 2019-04-16
SHENZHEN TCL NEW-TECH CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This application provides a terminal heat dissipation control method, device and storage medium, aiming to solve the problems in the prior art that heat sinks are used to dissipate heat from the terminal system chip, the heat dissipation capability is poor, and the operating temperature of the terminal system chip is too high

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  • Method and device for terminal heat dissipation control, and storage medium
  • Method and device for terminal heat dissipation control, and storage medium
  • Method and device for terminal heat dissipation control, and storage medium

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Embodiment Construction

[0042] In order to better understand the above-mentioned technical solutions, exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0043] The main solution of the embodiment of the present invention is to obtain the operating current of the terminal system chip and the open state of the fan group in the fan system; obtain the The current temperature of the terminal system chip; judging whether the current temperature of the terminal system chip is greater than the preset temperature; when th...

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Abstract

The invention discloses a method and a device for terminal heat dissipation control, and a storage medium. The heat dissipation control method of the terminal comprises the following steps: obtainingworking current of a chip of a terminal system and the starting state of a fan set in a fan system; obtaining the current temperature of the terminal system chip according to the working current of the terminal system chip and the starting state of a fan group in the fan system; judging whether the current temperature of the terminal system chip is greater than a preset temperature or not; and when the current temperature of the terminal system chip is greater than the preset temperature, adjusting the operation state of a fan group in a fan system so as to reduce the temperature of the terminal system chip. According to the technical scheme, the problems that in the prior art, cooling fins are used for cooling a terminal system chip, the cooling capacity is poor, and the working temperature of the terminal system chip is too high are solved.

Description

technical field [0001] The present invention relates to the technical field of heat dissipation, in particular to a heat dissipation control method, device and storage medium of a terminal. Background technique [0002] The thinning of electronic products is the development trend of the future market. Compared with ordinary electronic products, thin electronic products have the advantages of smaller volume and more beautiful appearance, so they are favored by people. [0003] However, current electronic products, such as televisions, generally use very large scale integrated circuits, such as system-on-chip SOCs, as processors, which consume a lot of power and operate at high temperatures. Therefore, it is necessary to cool them down. However, due to the thinning of electronic products, the space of electronic products is limited, and the volume of heat sinks (made of materials such as aluminum, copper, graphite, etc.) is also limited. The ability is poor, resulting in the ...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20209
Inventor 康伟
Owner SHENZHEN TCL NEW-TECH CO LTD
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