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High-flame-retardance conductive foam gum and preparation process thereof

A conductive foam, high flame-retardant technology, applied in lamination, layered products, metal layered products, etc. Cotton-backed adhesive application surface is narrow and other problems, to achieve the effect of light weight, high specific strength and good sealing performance

Active Publication Date: 2019-04-23
苏州腾茂电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. Because the foam needs to have flame retardant and conductive effects according to the functional requirements in the application process, the foam on the market usually has no obvious flame retardant and conductive properties, or the effect of combining the two is not satisfactory
[0005] 2. Traditional PE, PU and melamine foam have good cushioning and sound-absorbing properties, but due to the limitation of processing technology, it is impossible to obtain a high expansion ratio and ultra-thin cushioning foam material layer
The traditional processing technology can only get the buffer foam material layer above 1mm
[0006] 3. Because the foam substrate used in the traditional foam adhesive is too single, the application area of ​​the foam adhesive is narrow and the cushioning performance is not good.

Method used

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  • High-flame-retardance conductive foam gum and preparation process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0083] like figure 1 A highly flame-retardant conductive foam back adhesive shown includes: a foam layer unit 1, an aluminum foil cloth 2 and an embossed release paper 3; the outer side of the foam layer unit 1 is surrounded by an aluminum foil cloth 2; The side of the aluminum foil cloth 2 away from the foam layer unit 1 is provided with an embossed release paper 3; the foam layer unit 1 includes: a first porous material flame-retardant layer 11, a PET conductive buffer foam layer base material 12, the first conductive glue bonding layer 13, the EVA conductive buffer foam layer base material 14, the second porous material flame-retardant layer 15; one side of the first conductive glue bonding layer 13 is provided with a PET conductive buffer foam Cotton layer substrate 12; the other side of the first conductive glue bonding layer 13 is provided with an EVA conductive buffer foam layer substrate 14; the PET conductive buffer foam layer substrate 12 is far away from the first c...

Embodiment 2

[0126] like figure 1 A highly flame-retardant conductive foam back adhesive shown includes: a foam layer unit 1, an aluminum foil cloth 2 and an embossed release paper 3; the outer side of the foam layer unit 1 is surrounded by an aluminum foil cloth 2; The side of the aluminum foil cloth 2 away from the foam layer unit 1 is provided with an embossed release paper 3; the foam layer unit 1 includes: a first porous material flame-retardant layer 11, a PET conductive buffer foam layer base material 12. First conductive glue bonding layer 13, EVA conductive buffer foam layer substrate 14, second porous material flame-retardant layer 15; one side of the first conductive glue bonding layer 13 is provided with PET conductive buffer foam layer substrate 12; the other side of the first conductive glue bonding layer 13 is provided with an EVA conductive buffer foam layer substrate 14; the PET conductive buffer foam layer substrate 12 is far away from the first conductive glue bonding la...

Embodiment 3

[0169] like figure 1 A highly flame-retardant conductive foam back adhesive shown includes: a foam layer unit 1, an aluminum foil cloth 2 and an embossed release paper 3; the outer side of the foam layer unit 1 is surrounded by an aluminum foil cloth 2; The side of the aluminum foil cloth 2 away from the foam layer unit 1 is provided with an embossed release paper 3; the foam layer unit 1 includes: a first porous material flame-retardant layer 11, a PET conductive buffer foam layer base material 12. First conductive glue bonding layer 13, EVA conductive buffer foam layer substrate 14, second porous material flame-retardant layer 15; one side of the first conductive glue bonding layer 13 is provided with PET conductive buffer foam layer substrate 12; the other side of the first conductive glue bonding layer 13 is provided with an EVA conductive buffer foam layer substrate 14; the PET conductive buffer foam layer substrate 12 is far away from the first conductive glue bonding la...

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Abstract

The invention discloses high-flame-retardance conductive foam gum and a preparation process thereof. By virtue of scientific and orderly structure design, proportioning of base materials and operationprocedures, the prepared foam gum has both excellent flame retardance and conductivity. An overall thickness of a foam layer unit is 0.1 to 0.4 mm, so that the foam gum prepared in the invention hasthe buffering performance, also has the characteristic of ultrathin thickness, and is wider in application range. By arranging a PET conductive buffering foam layer base material and an EVA conductivebuffering foam layer base material, the foam layer unit is diversified in composition and is wider in application and excellent in buffering effect.

Description

technical field [0001] The invention belongs to the technical field of foam adhesive preparation, in particular to a highly flame-retardant conductive foam adhesive and a preparation process thereof. Background technique [0002] Buffer foam adhesive is a material with shock absorption, sound absorption and sealing effect, which is prepared from foam material as the base material through composite release materials. It is widely used in electronic and electrical products, mechanical parts, various small household appliances, mobile phones Insulation, paste and sealing of accessories, industrial instruments, computers and peripheral equipment, auto parts, audio-visual equipment, toys, cosmetics, craft gifts, medical instruments, electric tools, office stationery, shelf display, home decoration, acrylic glass, ceramic products, etc. , anti-slip and cushioning shockproof. [0003] Currently, there are mainly the following problems: [0004] 1. Because the foam needs to have f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B3/24B32B7/12B32B15/08B32B15/12B32B15/20B32B27/08B32B33/00B32B37/30B32B27/36
CPCB32B3/266B32B5/18B32B7/12B32B15/08B32B15/12B32B15/20B32B27/08B32B33/00B32B2266/0221B32B2266/0264B32B2307/202B32B2307/3065
Inventor 黄林妹俞希达吴婷
Owner 苏州腾茂电子科技有限公司
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