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Three-dimensional optical waveguide manufacturing method

A manufacturing method and optical waveguide technology, which are applied in the directions of optical waveguides, light guides, optics, etc., can solve the problems that two-dimensional structures cannot meet circuit layout, many functional modules, and are complicated, and achieve the effect of facilitating computer circuit layout design.

Inactive Publication Date: 2019-04-23
苏州席正通信科技有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

[0004] At present, the optical waveguide substrate is still a planar two-dimensional structure, and its manufacturing method is still based on semiconductor chip processing such as etching and chemical vapor deposition, which is suitable for mass production, while customized small-batch production is costly; at present, the computer internal network More complex, more functional modules, two-dimensional structure, and unable to meet the requirements of circuit layout; The manufacturing process of the mirror is complicated and the cost is high

Method used

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Embodiment

[0030] Implementation examples: such as figure 1 as shown,

[0031] A method for manufacturing a three-dimensional optical waveguide is provided to solve at least one technical problem in the prior art.

[0032] The technical solution for achieving the above purpose is: a method for manufacturing a three-dimensional optical waveguide, including a waveguide 11, a substrate 12, a waveguide transverse branch 13, and a waveguide longitudinal branch 14;

[0033] Further, the refractive index of the waveguide 11 is higher than that of the substrate 12. When light enters from one end of the waveguide, the light can be transmitted along the waveguide 11 due to the total reflection formed at the interface between the waveguide 11 and the substrate 12;

[0034] Further, there are waveguide transverse branches 13 and waveguide longitudinal branches 14 distributed on the waveguide 11, and when light travels along the waveguide 11 and encounters branches, it will be divided into two beams...

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Abstract

The invention discloses a three-dimensional optical waveguide manufacturing method. A three-dimensional optical waveguide comprises a waveguide body, a base body, a waveguide lateral branch and waveguide longitudinal branches. The refractive index of the waveguide body is higher than that of the base body. When light is incident from one end of the waveguide body, the light forms total reflectionon the interface between the waveguide body and the base body, so light can be transmitted internally along the waveguide body; the waveguide lateral branch and the waveguide longitudinal branches aredistributed on the waveguide body, the light is split into two beams according to a certain power ratio when the light meets the branches when the light is transmitted along the waveguide; the 3D printed three-dimensional optical waveguide is a multi-layer three-dimensional optical waveguide structure formed by first linearly stacking materials to form a layer in sequence by a 3D printer and stacking the layers in sequence, wherein the position at which the waveguide body is located is a hollow pipe after printing; waveguide materials are poured into the hollow pipe along a filling port and solidified to form the waveguide body; and the six faces of the optical waveguide structure are further ground and polished to achieve the effect of connecting an externally connected optical waveguidefor light transmission.

Description

technical field [0001] The invention relates to the fields of optoelectronic integrated circuit boards and the like, in particular to a method for manufacturing a three-dimensional optical waveguide. Background technique [0002] Science and technology in the 21st century are changing with each passing day. As a high-tech industry, the electronics industry is experiencing rapid technological development. At present, with the rapid and comprehensive development of multimedia services, including telephone, cable TV (CATV), digital TV and Internet, the requirements for circuit bandwidth and capacity have increased dramatically. In the traditional field of electricity, the speed of signal transmission and switching has been limited. Taking electronic computers as an example, the main frequency of its CPU has reached 2-2.9GHz, and the speed of transmitting code streams on the telecommunications trunk line has even reached dozens or even thousands of Gbits. In contrast, the bus ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/12G02B6/125G02B6/13
CPCG02B6/12002G02B6/125G02B6/13
Inventor 谷丽芳
Owner 苏州席正通信科技有限公司