Bonding wax detergent for semiconductor chips
A cleaning agent and semi-conductor technology, applied in detergent composition, non-surface active detergent composition, non-surface active detergent composition, etc., can solve the problem of irritating odor, limited practical application, and damage to aromatic derivatives. Human health and other issues, achieve the effect of balanced penetration and wax washing performance, simple cleaning process, and accelerated cleaning
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Embodiment 1
[0007] The bonding wax cleaning agent for semiconductor chips of the present invention has the following raw materials and quality backup ratios: 6% of C8 hydrocarbon solvent, 58% of C10 hydrocarbon solvent, 8% of C13 hydrocarbon solvent, and 28% of dipropylene glycol dimethyl ether.
Embodiment 2
[0009] The bonding wax cleaning agent for semiconductor chips of the present invention has the following raw materials and quality backup ratios: 5% C9 hydrocarbon solvent, 70% C12 hydrocarbon solvent, 5% C14 hydrocarbon solvent, and 20% dipropylene glycol dimethyl ether.
Embodiment 3
[0011] The bonding wax cleaning agent for semiconductor chips of the present invention, the raw materials used and the quality backup ratio are as follows: the mass composition is: C8 hydrocarbon solvent 10%, C11 hydrocarbon solvent 50%, C14 hydrocarbon solvent 10%, dipropylene glycol dimethyl ether The content is 30%.
[0012] The product of embodiment 1,2,3 of the present invention is colorless transparent liquid, and smell is extremely slight. Using Example 1, Example 2, Example 3 of the present invention, imported wax-removing cleaning agent and domestic wax-removing cleaning agent respectively, soak the bonded wax chip under the condition of 80°C. Results Example 1, Example 2, and Example 3 of the present invention were soaked for 10 minutes, the chips and equipment were free from corrosion, and no residual wax was found on the surface of the chips, and they were thoroughly cleaned. Soak in imported wax-removing cleaning agent for 20 minutes, the chip and equipment have ...
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