Bonding wax detergent for semiconductor chips

A cleaning agent and semi-conductor technology, applied in detergent composition, non-surface active detergent composition, non-surface active detergent composition, etc., can solve the problem of irritating odor, limited practical application, and damage to aromatic derivatives. Human health and other issues, achieve the effect of balanced penetration and wax washing performance, simple cleaning process, and accelerated cleaning

Pending Publication Date: 2019-04-26
DALIAN SANDAAOKE CHEM
View PDF3 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the imported wax removal cleaning agent can dissolve the paraffin wax in the bonding wax, but the rosin derivatives need to be removed by subsequent chemicals, the cleaning process is complicated and the efficiency is low
Domestic wax-removing cleaners use solvent oils containing aromatic derivatives, because aromatic derivatives and rosin derivatives have a more similar structure, in addition to th

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0007] The bonding wax cleaning agent for semiconductor chips of the present invention has the following raw materials and quality backup ratios: 6% of C8 hydrocarbon solvent, 58% of C10 hydrocarbon solvent, 8% of C13 hydrocarbon solvent, and 28% of dipropylene glycol dimethyl ether.

Embodiment 2

[0009] The bonding wax cleaning agent for semiconductor chips of the present invention has the following raw materials and quality backup ratios: 5% C9 hydrocarbon solvent, 70% C12 hydrocarbon solvent, 5% C14 hydrocarbon solvent, and 20% dipropylene glycol dimethyl ether.

Embodiment 3

[0011] The bonding wax cleaning agent for semiconductor chips of the present invention, the raw materials used and the quality backup ratio are as follows: the mass composition is: C8 hydrocarbon solvent 10%, C11 hydrocarbon solvent 50%, C14 hydrocarbon solvent 10%, dipropylene glycol dimethyl ether The content is 30%.

[0012] The product of embodiment 1,2,3 of the present invention is colorless transparent liquid, and smell is extremely slight. Using Example 1, Example 2, Example 3 of the present invention, imported wax-removing cleaning agent and domestic wax-removing cleaning agent respectively, soak the bonded wax chip under the condition of 80°C. Results Example 1, Example 2, and Example 3 of the present invention were soaked for 10 minutes, the chips and equipment were free from corrosion, and no residual wax was found on the surface of the chips, and they were thoroughly cleaned. Soak in imported wax-removing cleaning agent for 20 minutes, the chip and equipment have ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a bonding wax detergent for semiconductor chips. The bonding wax detergent is prepared from the raw materials in percentage by mass: 5%-10% of a C8 hydrocarbon solvent or C9 hydrocarbon solvent, 50%-70% of a C10 hydrocarbon solvent or C11 hydrocarbon solvent or C12 hydrocarbon solvent, 5%-10% of a C13 hydrocarbon solvent or C14 hydrocarbon solvent, and 20%-30% of dipropylene glycol dimethyl ether. All the components are matched mutually to completely dissolve components of bonding wax and remove bonding wax and other dirt on the surfaces of the chips, subsequent chemical cleaning operation is omitted, the cleaning process is simple, efficiency is high, the smell is light, and the semiconductor chips and cleaning equipment cannot be corroded.

Description

technical field [0001] The invention belongs to the technical field of special cleaning agents, in particular to a cleaning agent for bonding wax for semiconductor chips. Background technique [0002] The main components of the bonding wax used in the semiconductor chip manufacturing process are paraffin wax and rosin derivatives, and cleaning agents are needed to remove the bonding wax and other dirt on the surface of the chip. At present, the imported wax removal cleaning agent can dissolve the paraffin component in the bonding wax, but the rosin derivatives need to be removed by subsequent chemicals, and the cleaning process is complicated and inefficient. Domestic wax-removing cleaners use solvent oils containing aromatic derivatives, because aromatic derivatives and rosin derivatives have a more similar structure, in addition to the dissolution of hydrocarbon solvents on paraffin, it can enhance the cleaning of rosin derivatives However, it still needs follow-up chemic...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C11D7/60C11D7/26C11D7/24C11D7/50
CPCC11D7/24C11D7/263C11D7/5027
Inventor 杨同勇李文瀚刘佳由奉先高阳那久智
Owner DALIAN SANDAAOKE CHEM
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap