Display panel, manufacturing method thereof, and display device
A display panel and manufacturing method technology, applied in the fields of final product manufacturing, sustainable manufacturing/processing, semiconductor/solid-state device manufacturing, etc., can solve problems such as deterioration of semiconductor active layer characteristics, poor display effect of display panels, etc., and achieve improvement The overall display effect, the best shading effect, and the effect of avoiding deterioration
Active Publication Date: 2021-01-15
BOE TECH GRP CO LTD
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Problems solved by technology
[0004] In view of this, the present invention provides a display panel, a manufacturing method thereof, and a display device, which are used to solve the problem of deterioration of the characteristics of the semiconductor active layer caused by laser irradiation during the laser lift-off process of the top-gate flexible display panel, which makes the overall display panel Problems with poor display performance
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[0048] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.
[0049] figure 1 A schematic structural diagram of a display panel according to an embodiment of the present invention is shown. Such as figure 1 As shown, the embodiment of the present invention discloses a display panel, which includes: a substrate 2 , a semiconductor active layer 4 , a gate insulating layer 5 and a gate 6 located on a base 1 in sequence. The display panel also includes a fluorescent layer 7 . The fluorescent l...
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An embodiment of the present invention provides a display panel, including: a substrate, a semiconductor active layer, a grid insulating layer, and a grid sequentially located on a base, and a fluorescent layer. The phosphor layer is located on the substrate, and is used to block the light irradiating the semiconductor active layer when the substrate is subsequently stripped by laser lift-off technology. The invention also discloses a manufacturing method of the display panel and a display device. The present invention replaces the metal light-shielding layer with a fluorescent layer. Since the fluorescent layer can absorb high-energy light, the electrons undergo a transition, and the electronic orbital in the original ground state transitions to a higher excited state orbital. Because the excited state orbit is unstable, it then transitions from a higher excited state orbit to a lower energy ground state, and low energy light has no effect on the semiconductor active layer. The fluorescent layer can absorb high-energy light without reflecting high-energy light, so it can achieve a better light-shielding effect and avoid deterioration of the semiconductor active layer.
Description
technical field [0001] The invention relates to the field of display technology, in particular to a display panel, a manufacturing method thereof, and a display device. Background technique [0002] Due to the characteristics of organic light-emitting diodes such as self-illumination, wide viewing angle, low energy consumption, and high contrast ratio, organic light-emitting diodes are known as the next-generation products of liquid crystal displays. Compared with the current low-temperature polysilicon technology, oxidation technology has obvious advantages in the direction of large-scale organic light-emitting diodes, with simple process and good uniformity. Among them, the top gate structure prevents the channel from being affected by the light from the display. However, flexible bending is an important direction for the development of organic light-emitting diodes. When the flexible thin film substrate is laser-stripped from the glass surface, the channel will be irradia...
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IPC IPC(8): H01L27/32H01L51/00H10K99/00
CPCY02E10/549Y02P70/50H10K59/126H10K71/80H10K77/111H10K71/00H10K59/873H10K50/844H10K59/122H10K59/124H10K59/1201H10K2102/311
Inventor 李士佩姚琪黎午升卢江楠吴慧利贺芳顾仁权尹东升徐胜何伟
Owner BOE TECH GRP CO LTD