A low-pass filter design method based on through-silicon-via

Abstract

The invention discloses a low-pass filter design method based on a through-silicon-via, and mainly solves the problems that the existing low-pass filter design method based on the through-silicon-viais complex in process and needs a large amount of time and computing resources. According to the implementation scheme, the method comprises the steps that 1) determining low-pass filter model selection and design indexes according to engineering requirements and filter input conditions; 2) determining each element value of the low-pass filter according to the design index, and establishing a lumped circuit diagram of the filter; 3) according to each energy-saving inductance element value in the lumped circuit diagram, determining the row spacing, the column spacing and the inductance turn number of the arrangement of the silicon through holes in each section of three-dimensional integrated inductor; 4) determining the thickness of an inner dielectric layer of each section of coaxial through-silicon-via capacitor according to each section of capacitor element value in the lumped circuit diagram; And 5) establishing a three-dimensional model of the through-silicon-via low-pass filter inelectromagnetic software by using the parameters determined in the step 3) and the step 4), and simulating to complete the design of the whole low-pass filter, The method is simple in design and shorter in time consumption, and can be used for a radio frequency wireless communication system.

Description

technical field [0001] The invention belongs to the field of electronic technology, and in particular relates to a design method of a low-pass filter, which can be used in the field of radio frequency wireless communication. Background technique [0002] The low-pass filter is an important passive component in the RF front-end section. With the development of modern wireless communication technology, the requirements for communication equipment and communication systems are miniaturization, high speed and multi-function. Due to the large size of inductors and capacitors in traditional passive filters, existing packaging technologies cannot integrate radio frequency units such as traditional passive filters into the system. For this reason, in recent years, more and more researches have been done on the filter technology based on the capacitance and inductance of the through-silicon vias. [0003] Patent CN106158835A proposes a low-pass filter based on TSV technology, which...

AI Technical Summary

Problems solved by technology

This simulation-based TSV low-pass filter design process is complex and requires a lot of time and computing resources, thus limiting the output of TSV-based low-pass filters

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