Extrusion type slit coating packaging equipment

Abstract

The invention discloses extrusion type slit coating packaging equipment. The extrusion type slit coating packaging equipment comprises a coating system and a motion control system, wherein the coatingsystem is provided with a coating die head, and the bottom of the coating die head is provided with a discharge gap; the motion control system is used for enabling the coating system to have the translation freedom degree along the horizontal plane and the reciprocating linear freedom degree in the vertical direction, and a rotation degree of freedom around the plumb line; the motion control system comprises a first screw rod which is horizontally arranged and is perpendicular to each other, a second screw rod, a motion control system and a telescopic shaft, wherein the telescopic shaft is connected with the top of the coating die head, and the telescopic shaft is provided with a vertical telescopic degree of freedom and a degree of freedom of rotation around the axis direction of the telescopic shaft; and the axis of the telescopic shaft penetrates through the shape center of the coating die head or penetrates through the end point of the discharge gap. The coating die head has the translation degree of freedom in the space XYZ direction and the rotation degree of freedom along the axis Z, wide substrate products are more narrower and wider in application width, the applicabilityis higher, and the coating efficiency is improved.

Description

technical field [0001] The invention relates to the field of coating equipment, in particular to an extrusion type slit coating packaging equipment. Background technique [0002] At present, the packaging method in the form of dispensing is widely used in the research and development and production of optoelectronic devices, semiconductor devices, and functional films. The purpose of encapsulation has also developed from the initial protective function to the requirements of blocking water and oxygen to the requirements of high light transmission and uniform heat dissipation. The materials used in the packaging process include glue, resin, ceramics and many other materials. The packaging effect determines the most important process link of the overall function of optoelectronic devices, chips and functional films. [0003] Taking the packaging of flexible photovoltaic devices as an example, the dispensing process is to use a precision glue supply pump to inject the slurry ...

AI Technical Summary

Problems solved by technology

Of course, there are some disadvantages in using the extrusion slit coating method for encapsulation. Since only strip coating can be completed, the pattern transformation of the encapsulation ...

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