Heat sink for power module and power module made therefrom

Abstract

The invention discloses a cooling fin for a power module and the power module made of the cooling fin. A cooling substrate is a copper plate, and the cooling fin further includes an oxidation resistant coating and a resin layer, wherein the oxidation resistant coating and the resin layer are respectively arranged on the two opposite sides of the copper plate. The resin layer is a single-layer structure resin layer or a double-layer structure resin layer; when the resin layer is the single-layer structure resin layer, the single-layer structure resin layer is composed of a first epoxy resin composition, when the resin layer is the double-layer structure resin layer, the double-layer structure resin layer includes a first resin layer formed on the copper plate and a second resin layer formedon the first resin layer, the first resin layer is composed of a second epoxy resin composition, and the second resin layer is composed of a third epoxy resin composition; and the power module is made of the cooling fin. The cooling fin for the power module has the high insulating property , high heat dissipation property and good scratch resistant property, surface mounting is convenient, the high temperature resistant property is excellent, and meanwhile the bonding property and rigidity are excellent.

Description

technical field [0001] The invention belongs to the field of heat sinks, in particular to a heat sink for a power module and a power module made of the heat sink. Background technique [0002] The intelligent power module IPM (Intelligent Power Module) born in recent years is a new type of power switching device, which integrates the advantages of GTR and MOSFET, and has the advantages of high withstand voltage, high input impedance, high switching frequency, and low driving power. IPM integrates logic, control, detection and protection circuits, which is easy to use, not only reduces the size of the system and development time, but also greatly enhances the feasibility of the system, adapting to the development direction of today's power devices - modularization, Composite and power integrated circuits (PICs) have been more and more widely used in medium-sized fields such as textile machines, injection molding machines, inverter air conditioners, washing machines, refrigera...

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Problems solved by technology

[0005] However, although this patent has achieved good thermal conductivity, friction resistance and insulation, in practice, its thermal conductivity, adhesive performance, hardness and other properties are still slightly insufficient under relatively high standards. At high temperature (above 130°C), the heat sink produced by this patent still has the potential risk of performance degradation such as insulation, thermal conductivity, adhesive performance, withstand voltage, etc.

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