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Apparatus for chemical mechanical polishing of wafer

A chemical machinery and wafer technology, applied in grinding devices, grinding machine parts, grinding/polishing equipment, etc., which can solve the problems of lower yield and long process downtime.

Inactive Publication Date: 2019-05-21
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This results in long downtime for the process and also potentially reduces yield if the defect goes undetected under manual inspection

Method used

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  • Apparatus for chemical mechanical polishing of wafer
  • Apparatus for chemical mechanical polishing of wafer
  • Apparatus for chemical mechanical polishing of wafer

Examples

Experimental program
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Embodiment Construction

[0013] The following disclosure provides many different embodiments, or examples, for implementing different features of the presented subject matter. Specific examples of components and arrangements are set forth below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description, a first feature formed on or over a second feature may include embodiments where the first feature is formed in direct contact with the second feature, and may also include that additional features may be An embodiment formed between a first feature and a second feature such that the first feature and the second feature may not be in direct contact. Additionally, this disclosure may reuse reference numbers and / or letters in various instances. This repetition is for brevity and clarity and does not inherently dictate the relationship between the various embodiments and / or configurations discussed.

[0014] In a...

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Abstract

An apparatus for chemical mechanical polishing of a wafer includes a process chamber and a rotatable platen disposed inside the process chamber. A polishing pad is disposed on the platen and a wafer carrier is disposed on the platen. A slurry supply port is configured to supply slurry on the platen. A process controller is configured to control operation of the apparatus. A set of microphones is disposed inside the process chamber. The set of microphones is arranged to detect sound in the process chamber during operation of the apparatus and transmit an electrical signal corresponding to the detected sound. A signal processor is configured to receive the electrical signal from the set of microphones, process the electrical signal to enable detection of an event during operation of the apparatus, and in response to detecting the event, transmit a feedback signal to the process controller. The process controller is further configured to receive the feedback signal and initiate an actionbased on the received feedback signal.

Description

technical field [0001] The present disclosure relates to chemical mechanical polishing methods and devices for chemical mechanical polishing used in semiconductor manufacturing processes. Background technique [0002] The size of key features in integrated circuits (integrated circuits, ICs) continues to decrease, and the need to perform high-resolution photolithography processes is increasingly urgent. Consequently, the depth of focus of the radiation used to perform photolithography has also been reduced. The precision with which the wafer is planarized needs to be controlled on the atomic scale. For example, typical depth-of-field requirements for 28nm, 22nm, 16nm, and 10nm technologies approach the Angstrom level. Of course, these are examples only and are not intended to be limiting. [0003] Although chemical mechanical polishing (CMP) is most commonly used during wafer fabrication to provide an atomically flat surface at the beginning of the lithography process wit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/04B24B37/005B24B37/34H01L21/306
CPCH01L21/67288B24B37/105B24B49/003B24B57/02H01L22/10B24B37/0053B24B37/013H01L22/26H01L21/67092H01L21/30625
Inventor 王志佑王天文林胤藏周欣慧
Owner TAIWAN SEMICON MFG CO LTD