A kind of battery glue die-cutting processing method

Abstract

The invention provides a battery glue die cutting machining method. A first protecting film is covered with a second protecting film; the second protecting film is covered with first tearing paper; the first tearing paper is covered with a third protecting film, and the upper surface of the third protecting film has viscidity; first-time die cutting is performed on the third protecting film and the first tearing paper; second-time die cutting is performed on first mylar, the third protecting film is covered with the first mylar after being subjected to die cutting, and the first mylar is covered with first double-sided adhesive; third-time die cutting is performed on second double-sided adhesive, and waste discharging is performed; the second double-sided adhesive after being subjected todie cutting is covered with second mylar and fourth-time die cutting is performed; the first double-sided adhesive is covered with the second double-sided adhesive after being subjected to die cuttingand the second mylar, and fifth-time die cutting is performed; sixth-time die cutting is performed on second tearing paper, and waste discharging is performed; and the second double-sided adhesive iscovered with the second tearing paper after being subjected to die cutting, and seventh-time die cutting is performed. The battery glue die cutting machining method can effectively avoid that deforming displacement occurs to a product, and the yield of the product is guaranteed.

Description

technical field [0001] The invention relates to the technical field of die-cutting, in particular to a die-cutting processing method for battery glue. Background technique [0002] Such as figure 1 As shown, it is a schematic diagram of the structural decomposition of the battery adhesive, 01 is the first peeling paper, 02 is the first Mylar, 03 is the first double-sided adhesive, 04 is the second Mylar, 05 is the second double-sided adhesive, 06 is The second peel off. During the die-cutting process, the first Mylar 02 is die-cut and directly covered on the first peeling paper 01. When cutting the shape of the double-sided tape, the first double-sided tape 03, the second Mylar 04, the second The second double-sided adhesive tape 05 is covered on the first mylar 02 for die-cutting. At this time, since the first mylar 02 and the first peeling paper 01 are not sticky, the product is prone to extrusion, resulting in deformation and displacement, resulting in the appearance of...

AI Technical Summary

Problems solved by technology

During the die-cutting process, the first Mylar 02 is die-cut and directly covered on the first peeling paper 01. When cutting the shape of the double-sided tape, the first double-sided tape 03, the second Mylar 04, the second The second double-sided adhesive tape 05 is covered on the first mylar 02 for die-cutting. At this time, since the first mylar 02 and the first peeling paper 01 are not sticky, the product is prone to extrusion, resulting in deformation and displacement, resulting in the appearance of the product. unqualified

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