Closed-loop control device and closed-loop control method for closed thermal compounding temperature of tab forming

Abstract

The invention relates to a closed-loop control device for closed thermal compounding temperature of tab forming. The device comprises a tab heating and sealing device, a PLC, a touch screen, an electromagnetic heating controller and an electromagnetic heater, the tab heating device comprises a mounting bracket; a tab heating lower sealing piece moving cylinder at the bottom of the mounting bracketis connected with a lower sealing piece through a lower sealing piece supporting plate, and a tab heating upper sealing piece moving cylinder arranged at the top of the mounting bracket is connectedwith an upper sealing piece through an upper sealing piece supporting plate. A tab to be heat-sealed is arranged between the upper sealing piece and the lower sealing piece, a heating element of the electromagnetic heater is installed in the lower sealing piece, and the upper portion of the upper sealing piece is connected with an infrared temperature measuring sensor through an infrared temperature measuring sensor support. By changing the traditional heating temperature control mode, the precise control mode of closed heating, direct temperature measurement and closed-loop control of the heating temperature is realized, and the temperature control precision (+ / -2.5 DEG C) of automatic production is greatly improved and has a fluctuation only being 1 / 10 of the fluctuation of the traditional thermal compounding temperature.

Description

technical field [0001] The invention relates to the technical field of tab processing, in particular to a closed thermal compound temperature closed-loop control device and method for tab forming. Background technique [0002] There are a large number of single components in electronic components that need to be thermally combined with metal and solid non-metallic film, so that the solid non-metallic film and metal can be firmly bonded into a whole through hot melting and pressure, so as to realize the integration of the single component and the solid non-metallic film. When other components are used in combination, the effect of insulation and sealing can be achieved. For example, tabs for lithium-ion batteries are such typical electronic components. Tabs are made of PP material (we call them tab glue) and metals to form a whole through thermal compounding, such as figure 2 As shown, it is composed of tab glue 16 and metal sheet 17. At present, there are three kinds of po...

AI Technical Summary

Problems solved by technology

The temperature control of the above three thermal compound methods is an indirect and open temperature control method, which cannot accurately control the heating temperature of the heated body

The thermal recombination of the first heat conduction method and the thermal recombination of the second heat radiation method are to indirectly control the thermal recombination temperature of the tab by controlling the temperature of the intermediate heating body, and the third electromagnetic induction thermal recombination is by controlling the heater The output current and heating time are used to indirectly control the thermal lamination temperature. Therefore, for the above three thermal lamination methods, the temperature fluctuations during the thermal lamination process are large (usually the maximum temperature fluctuation range reaches ±25°C), and the bond strength after thermal lamination also varies with the temperature. Therefore, it cannot fully meet the bond strength requirements of precise thermal lamination

Images