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Array substrate, preparation method thereof and display screen

A technology for array substrates and display areas, applied in the fields of array substrates and their preparation, and display screens, can solve problems such as easy breakage of peripheral metal wiring, and achieve the effects of improving screen yield, improving reliability, and avoiding breakage

Active Publication Date: 2019-06-07
YUNGU GUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide an array substrate that is not easy to cause peripheral metal traces to break due to the problem that the peripheral metal traces are easily broken in the prior art.

Method used

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  • Array substrate, preparation method thereof and display screen
  • Array substrate, preparation method thereof and display screen
  • Array substrate, preparation method thereof and display screen

Examples

Experimental program
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preparation example Construction

[0059] The invention also provides a method for preparing the array substrate.

[0060] A method for preparing an array substrate, the array substrate has a display area and a non-display area located outside the display area; the method for preparing the non-display area includes the following steps:

[0061] S1. Forming a buffer layer on a flexible substrate.

[0062] S2, forming amorphous silicon film strips on the buffer layer.

[0063] S3, covering the inorganic film layer on the amorphous silicon film strip and the buffer layer.

[0064] S4. Open a step hole on the inorganic film layer to leak the side vertices of the amorphous silicon film strip; then fill the step hole with a source of migration metal, and then temper to make part of the metal atoms in the source of transfer metal migrate to the non-crystalline silicon Silicon film strips to form elastic film strips.

[0065] S5, forming peripheral metal wiring on the inorganic film layer.

[0066] Wherein, Step S1...

Embodiment 1

[0081] Coating on glass to form 8um thick flexible substrate (PI); PECVD on flexible substrate to form 60nm thick barrier layer (SiO 2 ); on the barrier layer, PECVD forms a 60nm thick buffer layer (SiNx); on the buffer layer, CVD deposition forms a 50nm thick amorphous silicon layer; on the amorphous silicon layer, CVD deposition forms a 10nm thick GI layer (SiO 2 ); on the GI layer, CVD deposition forms a 10nm thick CI layer (SiNx); on the CI layer, CVD deposition forms a 60nm thick ILD layer (SiO2); generates via holes by dry etching; on the ILD layer, sputtering (Sputter ) deposition to form a 55nm thick metal layer (Ti / Al / Ti). Tempering yields Product A.

[0082] Using an optical microscope (Nikon L300ND) to irradiate product A with reflected light from the side of the flexible substrate, the enlarged image obtained is shown in image 3 .

[0083] from image 3 , it can be seen that the brightness of the amorphous silicon layout is high, and it has an aluminum metal c...

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Abstract

The invention relates to an array substrate. A non-display region of the array substrate comprises a flexible substrate, a buffer layer, an elastic membrane strip, an inorganic membrane layer, a migration metal source body and peripheral metal wires. The buffer layer is formed on the flexible substrate layer, the elastic membrane strip is formed on the buffer layer, the inorganic membrane layer covers the elastic membrane strip and the buffer layer, a stepped hole enabling the side vertex angle of the elastic membrane strip to be exposed is formed in the inorganic membrane layer, the stepped hole is filled with the migration metal source body, and the peripheral metal wires are formed on the inorganic membrane layer. According to the array substrate, as the migration metal source body is arranged, metal atoms are migrated into the elastic membrane strip, and the elastic membrane strip has metal elasticity; when the elastic membrane strip has the metal elasticity, stress can be relievedwhen the buffer layer is bent, thus, pressure borne by the peripheral metal wires is reduced, then the probability that the peripheral metal wires are broken is reduced, then the reliability of the array substrate is improved, and finally the yield of screen bodies is increased. The invention further provides a preparation method of the array substrate and a display screen.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an array substrate, a preparation method thereof, and a display screen. Background technique [0002] The display screen includes a display area (AA area) and a non-display area (non-AA area). In order to achieve certain functions, the non-display area is required to be bendable. For example, in order to achieve a narrow frame, the non-display area is bent to the back of the screen, thereby reducing the width of the frame. [0003] However, in the current display screen, during the bending process of the non-display area, the buffer layer (buffer layer) in the non-display area breaks, and then the peripheral metal wires are easily broken, resulting in a defective screen body. Contents of the invention [0004] Based on this, it is necessary to provide an array substrate that is less likely to cause breakage of the peripheral metal wires to solve the problem that the periphera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/30
Inventor 李威龙张九占朱晖张露韩珍珍胡思明
Owner YUNGU GUAN TECH CO LTD