Flexible substrate and preparing method thereof
A flexible substrate, inorganic layer technology, applied in the direction of instruments, electrical components, electrical solid devices, etc., can solve problems such as poor adhesion, display panel damage, etc., and achieve the effect of improving adhesion and reliability.
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[0019] The specific implementation of the flexible substrate provided by the present invention and its preparation method will be described in detail below in conjunction with the accompanying drawings.
[0020] figure 1 It is a schematic diagram of the side structure of the flexible substrate of the present invention. see figure 1 , The flexible substrate of the present invention includes a first polymer layer 10 , an inorganic layer 11 and a second polymer layer 12 . The inorganic layer 11 covers the first polymer layer 10 , and the second polymer layer 12 covers the inorganic layer 11 .
[0021] The first polymer layer 10 is a flexible layer, and the materials for making the first polymer layer 10 include but are not limited to PI (polyimide), PEI (polyetherimide), PPS (polyphenylene sulfide) ) and PAR (polyarylate) in one or more combinations. Wherein, in this embodiment, the thickness range of the first polymer layer 10 is 5-15 μm, and in other embodiments, the thickn...
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