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Flexible substrate and preparing method thereof

A flexible substrate, inorganic layer technology, applied in the direction of instruments, electrical components, electrical solid devices, etc., can solve problems such as poor adhesion, display panel damage, etc., and achieve the effect of improving adhesion and reliability.

Inactive Publication Date: 2019-06-07
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the poor adhesion between the polymer material and the inorganic material, it is easy to cause the separation of the upper polymer material and the inorganic material during the subsequent production of the display panel or the use of the display panel, resulting in damage to the display panel.

Method used

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  • Flexible substrate and preparing method thereof
  • Flexible substrate and preparing method thereof
  • Flexible substrate and preparing method thereof

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Embodiment Construction

[0019] The specific implementation of the flexible substrate provided by the present invention and its preparation method will be described in detail below in conjunction with the accompanying drawings.

[0020] figure 1 It is a schematic diagram of the side structure of the flexible substrate of the present invention. see figure 1 , The flexible substrate of the present invention includes a first polymer layer 10 , an inorganic layer 11 and a second polymer layer 12 . The inorganic layer 11 covers the first polymer layer 10 , and the second polymer layer 12 covers the inorganic layer 11 .

[0021] The first polymer layer 10 is a flexible layer, and the materials for making the first polymer layer 10 include but are not limited to PI (polyimide), PEI (polyetherimide), PPS (polyphenylene sulfide) ) and PAR (polyarylate) in one or more combinations. Wherein, in this embodiment, the thickness range of the first polymer layer 10 is 5-15 μm, and in other embodiments, the thickn...

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Abstract

The invention provides a flexible substrate and a preparing method thereof. The flexible substrate has the advantages that inorganic matter protrusions are embedded in the bottom of a second polymer layer, the adhesiveness between the (organic) material of the second polymer layer and the inorganic material can be improved, and it is effectively avoided that the second polymer layer and the inorganic layer are separated in the subsequent manufacturing process of display panels and other devices or the use process of the display panels and other devices; by means of the inorganic layer, water and oxygen can be effectively prevented from entering a substrate middle layer, and the reliability of the display panels and other devices is improved.

Description

technical field [0001] The invention relates to the field of display devices, in particular to a flexible substrate and a preparation method thereof. Background technique [0002] In recent years, the flexibility of display panels has become a technological innovation point pursued by major mobile phone and display panel manufacturers. Bendable, foldable, curlable and even arbitrarily deformable panels are gradually turning from concept to reality. Different from traditional rigid panels, flexible panels need to use flexible substrates to achieve bendable, foldable, rollable and other properties. At present, the more mature technology is to use polymers, metal films, cardboard and other materials to make flexible substrates, and polymer materials are favored for their high flatness and good plasticity. [0003] Due to the high water permeability and poor high temperature resistance of polymer materials, if polymers are used as the substrate of the display panel, two layers ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/30H10K99/00
CPCG09F9/30
Inventor 张福阳
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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