Concave electrode flip chip structure and manufacturing method thereof

A technology of flip-chip and electrode structure, which is applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve problems such as unevenness and LED chip inclination, and achieve the effect of consistent light emitting direction, reducing inclination, and improving uniformity of color mixing

Active Publication Date: 2019-06-07
XIAMEN CHANGELIGHT CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, at present, the LED chip will appear tilted or uneven during the welding process with the substrate or bracket.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Concave electrode flip chip structure and manufacturing method thereof
  • Concave electrode flip chip structure and manufacturing method thereof
  • Concave electrode flip chip structure and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0038] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0039] refer to figure 1 , figure 1 A structural schematic diagram of a concave electrode type flip-chip structure provided by an embodiment of the present invention, the flip-chip structure includes:

[0040] S...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention discloses a concave electrode flip chip structure and a manufacturing method thereof. In the concave electrode flip chip structure, the thicknesses of a first electrode structureand a second electrode structure are smaller than the thickness of an isolation layer so that a solder fills the same surface as the isolation layer in the welding process so as to improve the smoothness of the welding surface, solve the phenomenon of the inclination and unevenness of a LED chip with small core particles in the welding process of a substrate or a support, make the LED chip smoothin light emitting surface and good in consistency of the light emitting direction, achieve an effect of a consistent light emitting direction on a display and a visual product, have no a polarizationphenomenon at the wide watching angle and improve the color mixture uniformity due to reduction of the inclination on the color mixture effect of the display.

Description

technical field [0001] The invention relates to the technical field of flip chips, and more specifically, to a concave electrode type flip chip structure and a manufacturing method. Background technique [0002] With the continuous development of science and technology, various LED chips have been widely used in people's daily life, work and industry, bringing great convenience to people's life. [0003] However, currently, the LED chip may be inclined or uneven during the welding process with the substrate or the bracket. Contents of the invention [0004] In view of this, in order to solve the above-mentioned problems, the present invention provides a concave electrode type flip-chip structure and manufacturing method, the technical scheme is as follows: [0005] A concave electrode type flip-chip structure, the flip-chip structure comprising: [0006] Substrate; [0007] an epitaxial layer structure disposed on the substrate; [0008] A first electrode structure and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/36H01L33/38H01L33/48H01L33/00
Inventor 杨勇志陈帅城李镇勇林锋杰苏丽娣
Owner XIAMEN CHANGELIGHT CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap