A polydopamine-modified hydrocarbon composition-based prepreg and its prepared copper-clad laminate

Abstract

The invention belongs to the field of communication materials, in particular to a polydopamine (PDA) modified hydrocarbon composition-based prepreg and a copper clad plate prepared by using the same.A Hydrocarbon composition with excellent dielectric properties is constructed by using hydroxyl-terminated, amino-terminated or mercapto-terminated modified polyaryl ether or polyolefin resin as matrix resin and epoxy resin as a main curing agent. In the present invention, the prepreg made by impregnating a dispersing solution of the hydrocarbon composition with a reinforcing material and then baking and drying has uniform adhesive content, good impregnation quality, strong resin adhesion, smooth surface, good toughness and appropriate viscosity. Furthermore, the high-frequency copper clad plate made of the prepreg and copper foil has good thermal and mechanical properties, excellent dielectric properties, good comprehensive performance stability, good uniformity and high copper foil peeling strength, which can meet the comprehensive performance requirements of substrate materials in the field of high frequency and high speed communications.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a polydopamine-modified hydrocarbon composition-based prepreg and a copper-clad laminate prepared therefrom. Background technique [0002] At present, the information electronics industry is in a stage of rapid development and is gradually becoming one of the pillar industries of various countries. Copper clad laminate is one of the key materials in the information electronics industry, and has been widely used in many fields such as communication base stations, satellites, unmanned vehicles, drones and intelligent robots. The traditional thermosetting copper clad laminate represented by epoxy resin has high thermal-mechanical properties, low thermal expansion coefficient, high quality and low price, convenient processing and strong versatility, and is the most widely used. After continuously optimizing the formula and process parameters, researchers have prepa...

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Problems solved by technology

However, except for polystyrene, polyphenylene ether generally has poor compatibility with other resins, resulting in serious phase separation of the resin in the prepreg composite matrix.

[0004] In addition, glass fiber cloth and inorganic fillers (such as silicon oxide, aluminum oxide, etc.) commonly used in the production of copper clad laminates have abundant hydrophilic functional groups on the surface - hydroxyl groups, while vinyl-modified polyphenylene ether groups and polydiene It does not contain hydrophilic functional groups such as oxygen and nitrogen, and has poor compatibility with glass fiber cloth and inorganic fillers. The dielectric properties and uniformity of different parts of the copper-clad laminate prepared by this method are not perfect, so it is not suitable for The production of multi-layer copper clad laminates is difficult to meet the requirements of the current high frequency and high speed communication fields for the diversification and complexity of the functions of copper clad laminate materials, and the high density of circuit layout.

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