Testing device for semiconductor thermoelectric refrigerating unit

Abstract

The invention belongs to the technical field of semiconductor thermoelectricity, and particularly relates to a testing device for a semiconductor thermoelectric refrigerating unit. The testing devicecomprises a main control module, a heat exchange module, a liquid medium pipeline module, an electricity supply module and a sensor module; the heat exchange module comprises a hot end exchanger and acold end exchanger, the hot end exchanger and the cold end exchanger are each provided with a liquid medium outlet and a liquid medium inlet, the liquid medium outlets and the liquid medium inlets are provided with temperature sensors correspondingly, the hot end exchanger and the cold end exchanger are provided with heat exchanging faces making contact with the cold end and the hot end of the semiconductor thermoelectric refrigerating unit, and heat-insulation layers are arranged on the outer surfaces, except for the outer surfaces of the heat exchanging faces and the liquid medium outlet and the liquid medium inlet, of the hot end exchanger and the cold end exchanger correspondingly; the liquid medium pipeline module is provided with a power pump controlled by the main control module; the electricity supply module comprises a direct-current electricity source controlled by the main control module; and the main control module is a computer. The testing device works through a water flow heat metering method, the heat exchange module in heat insulation with the exterior is adopted, thus heat emission in testing can be effectively prevented, and the measurement error can be effectively reduced.

Description

technical field [0001] The invention belongs to the technical field of semiconductor thermoelectricity, and in particular relates to a testing device for a semiconductor thermoelectric refrigerator. Background technique [0002] Thermoelectric refrigeration is a current refrigeration technology, which uses the Peltier effect of semiconductor bismuth telluride materials to transfer heat from one side of the material to the other side, forming a temperature difference, and achieving local cooling. [0003] Obtain the maximum cooling capacity per unit time when a certain semiconductor thermoelectric cooler product is actually working Q c,max And the maximum temperature difference between cold and hot ends Δ T max , optimal current and other parameters are very meaningful for the design and manufacture of semiconductor thermoelectric cooler products and practical use. Existing manufacturers only calculate these parameters based on the temperature difference between the hot an...

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Problems solved by technology

[0003] Obtain the maximum cooling capacity per unit time when a certain semiconductor thermoelectric cooler product is actually working Q c,max And the maximum temperature difference between cold and hot ends Δ T max , optimal current and other parameters are very meaningful for the design and manufacture of semiconductor thermoelectric cooler products and practical use. Existing manufacturers only calculate these parameters based on the temperature difference between the hot and cold plates of the thermoelectric cooler and the electrical parameters plus theoretical calculations. This semi-theoretical estimate does not take into account the heat leakage and heat conduction of the equipment used, and can only conduct a rough qualitative test for semiconductor thermoelectric cooler products. At present, there is still a lack of quantitative testing equipment for thermoelectric refrigeration devices in the industry.

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