Device and method for cleaning and drying wafer and chemical mechanical grinding table

Abstract

The invention discloses a device and method for cleaning and drying a wafer and a chemical mechanical grinding table. The device includes a drying tank, an object stage, a transfer arm and two first spray rods, the two first spray rods are arranged in parallel in the drying tank, the object stage is arranged on one side wall of the drying tank, the transfer arm carrying the wafer is movable upwardly along the object stage and passes between the two first spray rods, the first spray rod is provided with a plurality of obliquely downwardly opposite nozzle holes along the rod body, and the middleportion of the first spray rod is recessed downwardly so as to make the jet direction of the nozzle holes face outwardly. A gas mixture ejected from the first spary rod blows the residue on the surface of the wafer away from the edge of the wafer, reduces the accumulation of the residue along the lower edge of the wafer, avoids the accumulation of the residue to form a cluster residue defect, andimproves the yield.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer cleaning and drying device, method and chemical mechanical grinding machine platform. Background technique [0002] The CMP (Chemical Mechanical Polishing) process was first introduced into the semiconductor manufacturing industry by IBM in the late 1980s to solve the problem of flattening the surface of silicon wafers. key technologies. CMP mainly relies on the relative movement between the wafer and the polishing pad and the chemical erosion of the polishing liquid to achieve the purpose of grinding and removal. The machine used for chemical mechanical polishing generally consists of a chip mechanical transfer device, a grinding device, and a cleaning and drying device. The wafer is transferred by the transfer device to the grinding device for grinding, and then transferred to the cleaning and drying device for cleaning and drying. [0003] After ...

AI Technical Summary

Problems solved by technology

The current mainstream chemical mechanical polishing machines basically have their own cleaning and drying functions. During the wafer drying process, the machine mainly uses a gas mixture to purge the wafer surface to clean the brush residue and take away the residue on the wafer surface. Moisture achieves the purpose of drying, the increase of grinding residue and the decrease of brush cleaning ability will increase the residue on the surface of the wafer entering the drying tank, and the downward blowing of the spray bar will make the residue gather downward, making it difficult to dry and clean, and it is easy to form cluster residue Physical defects

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