Vacuum distribution module, vacuum suction cup and testing sorting machine

Abstract

The invention discloses a vacuum distribution module, a vacuum suction cup and a testing sorting machine for integrated circuit chip testing. The vacuum distribution module comprises a vacuum distribution bin, a vacuum distribution bin cover plate and a vacuum distribution bin connection plate. An annular vacuum chamber, a vacuum hole passage and a compressed air inlet hole passage are arranged inthe vacuum distribution bin, and a compressed air outlet hole passage is arranged in the vacuum distribution bin connection plate. Vacuum suction nozzles are evenly distributed on the vacuum suctioncup and can complete corresponding work on different work stations through a vacuum adsorption chip, the vacuum state of the suction nozzles is switched through the vacuum distribution module, vacuumis injected into the vacuum distribution module through the vacuum hole passage to form a vacuum bin, and air pressure is input into the compressed air inlet hole passage through an external electromagnetic valve and then transferred to a vacuum suction pen through the vacuum distribution bin, the compressed air outlet hole passage and an air pipe. When the vacuum distribution module is used for testing sorting equipment, chip positioning precision can be effectively ensured, the equipment operation efficiency is improved, and the production cost is reduced.

Description

technical field [0001] The invention relates to integrated circuit testing equipment, in particular to a vacuum distribution module for testing integrated circuit chips, a vacuum sucker and a test sorter. Background technique [0002] Integrated circuit turntable high-speed testing and sorting equipment is a high-end key equipment in the post-process of modern electronic manufacturing industry. It has the advantages of fast speed, high sorting efficiency and powerful function integration. Among them, the vacuum distribution device is the key component to complete chip pick-and-place, testing, and final product output. When the chip reaches each station, it needs to be positioned accurately to complete the corresponding function; with the development of advanced and high-end packaging technology, the new integrated circuit chip The packaging form is getting smaller and smaller, and the accuracy and speed requirements for integrated circuit testing and sorting equipment are ge...

AI Technical Summary

Problems solved by technology

In the prior art, when the integrated circuit testing equipment is running at high speed on the vacuum chuck, the vacuum intensity is too small during the operation due to the unreasonable vacuum distribution, which causes the chip to shift on the suction nozzle, so that when the chip arrives at each station to complete the corresponding Faults during work, resulting in chip damage and mechanical wear

Images