Method for rapidly removing organic solderable protective agent and oxide from substrate

Abstract

The invention discloses a method for rapidly removing an organic solderable protective agent and an oxide from a substrate. The method comprises the following steps: S1: feeding: placing a material tobe cleaned on a conveyor belt to start a cleaning process; S2: spraying and soaking: spraying and infiltrating the material to be cleaned with weakly alkaline liquid to perform a sufficient acid-baseneutralization reaction on the organic solderable protective agent and the oxide on a metal surface of the material to be cleaned with the chemical liquid medicine; S3: water washing: spraying and washing the material to be cleaned obtained in the step 2 with deionized water to wash the residual liquid medicine; and S4: hot air drying: drying the material to be cleaned obtained in the step S3 byusing circulating hot air, and using the material to be cleaned dried by the hot air in the next soldering step. By adoption of the method, the problems of poor cleanliness and low productivity in theexisting process are mainly solved.

Description

technical field [0001] The invention relates to a method for rapidly removing organic solderability protective agents and oxides of substrates, belonging to the technical field of semiconductor packaging. Background technique [0002] In the traditional semiconductor packaging technology, the process of removing organic solderability protective agents and oxides of the substrate is flux pre-cleaning. The disadvantages of this process are: 1. Although flux participates in the whole process, it plays a role in different intervals. The effect is different. When the solderability of the metal surface of the substrate to be welded is not ideal, the cleaning effect of the flux is not good, and welding defects such as virtual welding and bridging will generally occur; 2. The flux pre-cleaning process is complicated and the production capacity of the machine is low. Contents of the invention [0003] The purpose of the present invention is to solve the above-mentioned problems in ...

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Problems solved by technology

[0002] In the traditional semiconductor packaging technology, the process of removing organic solderability protective agents and oxides of the substrate is flux pre-cleaning. The disadvantages of this process are: 1. Although flux participates in the whole process, it plays a role in different intervals. The effect is different. When the solderability of the metal surface of the substrate to be welded is not ideal, the cleaning effect of the flux is not good, and welding defects such as virtual welding and bridging will generally appear; 2. The flux pre-cleaning process is complicated and the machine capacity is low

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