Multi-layer substrate low-inductance power module

A technology for power modules and multilayer substrates, applied in the field of low inductance power modules with multilayer substrates, can solve problems such as lowering system efficiency and reliability, transient voltage overshoot, and increased losses, and achieves the realization of inductive commutation paths and reduced The effect of small voltage current overshoot, power loss and electromagnetic interference reduction

Inactive Publication Date: 2019-06-21
SHANDONG NORMAL UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

With the increase of power module integration and power rating, the parasitic inductance caused by the circuit configuration can cause transi

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  • Multi-layer substrate low-inductance power module
  • Multi-layer substrate low-inductance power module
  • Multi-layer substrate low-inductance power module

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[0022] The present disclosure will be further described below with reference to the drawings and specific embodiments.

[0023] It should be pointed out that the following detailed descriptions are all illustrative and are intended to provide further explanations for the application. Unless otherwise indicated, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs.

[0024] It should be noted that the terms used here are only for describing specific implementations, and are not intended to limit the exemplary implementations according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should also be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate There are features, steps, operations...

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Abstract

The invention provides a multi-layer substrate low-inductance power module. The multi-layer substrate low-inductance power module comprises a substrate, wherein the substrate comprises a first substrate layer, a third substrate layer electrically connected with the first substrate layer, a fifth substrate layer used for heat dissipation of the substrate, a second substrate layer disposed between the first substrate layer and the third substrate layer and configured to electrically isolate the first substrate layer and the third substrate layer, and a fourth substrate layer disposed between thethird substrate layer and the fifth substrate layer and configured to electrically isolate the third substrate layer and the fifth substrate layer, wherein the first substrate layer is configured tocarry a switching current flowing in a first direction, the third substrate layer is configured to carry a switching current flowing in a second direction, and the first direction and the second direction are opposite. According to the multi-layer substrate low-inductance power module provided by the invention, due to the arrangement of the multi-layer substrate, the switching current directions are changed, the influence between the switching current directions is reduced, and then the parasitic inductance of the power module is reduced.

Description

technical field [0001] The present disclosure relates to a power module, in particular to a multilayer substrate low inductance power module. Background technique [0002] Power modules can be used in various power conversion fields. These fields include, for example, DC-DC conversion, DC-AC conversion, and AC-AC conversion. With the increase of power module integration and power rating, the parasitic inductance caused by the circuit configuration can cause transient voltage overshoot, oscillation, loss increase, and cause electromagnetic interference problems, reducing system efficiency and reliability. Therefore, it is very important to minimize the parasitic inductance of the power module. Contents of the invention [0003] In order to solve the deficiencies of the prior art, the present disclosure provides a multi-layer substrate low inductance power module. The present disclosure changes the direction of the switch current through the arrangement of the multi-layer ...

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Application Information

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IPC IPC(8): H02M1/00H01L25/16
Inventor 华庆郑家兴王士鑫冷严任俊峰
Owner SHANDONG NORMAL UNIV
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