51results about How to "Minimize capacitance" patented technology

provides SOI CMOS technology whereby a polysilicon back-gate is used to control the threshold voltage of the front-gate device, and the nMOS and pMOS back-gates are switched independently of each other and the front gates. Specifically, the present invention provides a method of fabricating a back-gated fully depleted CMOS device in which the device's back-gate is self-aligned to the device's front-gate as well as the source / drain extension. Such a structure minimizes the capacitance, while enhancing the device and circuit performance. The back-gated fully depleted CMOS device of the present invention is fabricated using existing SIMOX (separation by ion implantation of oxygen) or bonded SOI wafer bonding and thinning, polySi etching, low-pressure chemical vapor deposition and chemical-mechanical polishing.

A method for forming a silicon-on-insulator transistor (80) includes forming an active region (82) overlying an insulating layer (122), wherein a portion of the active region provides an intrinsic body region (126). A body tie access region (128) is also formed within the active region, overlying the insulating layer and laterally disposed adjacent the intrinsic body region, making electrical contact to the intrinsic body region. A gate electrode (134) is formed overlying the intrinsic body region for providing electrical control of the intrinsic body region, the gate electrode extending over a portion (137) of the body tie access region. The gate electrode is formed having a substantially constant gate length (88) along its entire width overlying the intrinsic body region and the body tie access region to minimize parasitic capacitance and gate electrode leakage. First and second current electrodes (98,100) are formed adjacent opposite sides of the intrinsic body region. In addition, a body tie diffusion (130) is formed within the active region and laterally offset from the body tie access region and electrically coupled to the body tie access region.

A semiconductor device is provided. The semiconductor device includes a substrate having transistor devices and a plurality of copper interconnect metallization lines and conductive vias. The plurality of copper interconnect metallization lines and conductive vias are defined in each of a plurality of interconnect levels of the semiconductor device such that the plurality of copper interconnect metallization lines and conductive vias are isolated from each other by an air dielectric. The semiconductor device further includes a plurality of supporting stubs each of which is configured to form a supporting column that extends through the plurality of interconnect levels of the semiconductor device.

The differential output of a Programmable Gain Amplifier (PGA) is loaded by the input differential gate capacitance of a plurality of Analog to Digital converters (ADC) comparators and the differential metal layer traces to interconnect these comparators to the PGA. The differential capacitive load presented to the PGA is quite large and reduces the bandwidth of this interconnect between the PGA and ADC. To overcome the performance degradation due to the differential capacitive load, an active negative-capacitor circuit cancels the effect of the large input capacitance of the ADC comparators. This cancellation extends the gain characteristics of the interconnect between the PGA's output and the inputs of the first stage of the comparators. The active negative-capacitance is comprised of a cross pair NMOS with a capacitor connecting their sources where each NMOS is biased by a current source.

This invention presents a kind of ion guide device comprising multiple layers of stretched wire electrodes crossing in space. These wire electrodes are distributed along a defined ion guiding axis in the ion guide device. Each layer of wire electrodes contains at least two wire electrodes with some distance away from the guiding axis, and rotates with an angle relative to wire electrodes on neighboring layer. The ion guide contains multiple layers of wire electrodes to form a cage-like ion guide tunnel and keeps the mounting framework of those wire electrodes outside of the ion guide tunnel, thus reducing the interference of the gas flows from the ion guide device. A power supply provides voltage to each layer of wire electrodes, creates an electric field which focuses the ions towards the guiding axis.

A liquid crystal display device and a driving method thereof capable of simplifying of a hardware construction of the liquid crystal display device driven by the impulsive driving method and minimizing capacitance of memory for storing data are provided.

A bipolar semiconductor overvoltage protection circuit presents less capacitance to a communication line. The overvoltage protection circuit includes an overvoltage protection device that is biased with a voltage to not only reduce the capacitance thereof, but also to reduce the change in capacitance as a function of frequency. Changes in communication line voltages thus change the capacitance of the overvoltage protection device less, resulting in the ability to allow the transmission of high capacity data protocols with reduced error rates.

A solid state relay composed of a series connected pair of LDMOSFETs has a minimized output capacitance. Each LDMOSFET is configured to have a silicon layer of a first conductive type, a drain region of the first conductive type diffused in the top surface of the silicon layer, a well region of a second conductive type diffused in the silicon layer in a laterally spaced relation from the drain region, and a source region of the first conductive type diffused within the well region to define a channel extending between the source region and a confronting edge of the well region along the top surface of the silicon layer. Each LDMOSFET is of an SOI (Silicon-On-Insulator) structure composed of a silicon substrate placed on a supporting plate, a buried oxide layer on the silicon substrate, and the silicon layer on the buried oxide layer. The well region is diffused over the full depth of the silicon layer to have its bottom in contact with the buried oxide layer, so that the well region forms with the silicon layer a P-N interface only at a small area adjacent the channel. Because of this reduced P-N interface and also because of the buried oxide layer exhibiting a much lower inductive capacitance than the silicon layer, it is possible to greatly reduce a drain-source capacitance for minimizing the output capacitance of the relay in the non-conductive condition.

A 3D integrated circuit memory array has a plurality of plane positions. Multiple bit line structures have a multiple sequences of multiple plane positions. Each sequence characterizes an order in which a bit line structure couples the plane positions to bit lines. Each bit line is coupled to at least two different plane positions to access memory cells at two or more different plane positions.

A surge protection device with small-area buried regions (38, 60) to minimize the device capacitance. The doped regions (38, 60) are formed either in a semiconductor substrate (34), or in an epitaxial layer (82), and then an epitaxial layer (40, 84) is formed thereover to bury the doped regions (38, 60). The small features of the buried regions (38, 60) are maintained as such by minimizing high temperature and long duration processing of the chip. An emitter (42, 86) is formed in the epitaxial layer (40, 84).

The present invention is directed to a method and system of intelligent dummy filling placement to reduce inter-layer capacitance caused by overlaps of dummy filling area on successive layers. The method and system treats each consecutive pair of layers together so as to minimize dummy filling overlaps between each layer. In particular, dummy fill features on each layer may be placed in a checkerboard pattern to avoid overlaps. As such, the present invention may eliminate large overlap area of the dummy patterns on consecutive layers by utilizing intelligent dummy filling placement.