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A cathode heating subassembly and its manufacturing method

A heat sub-cathode technology, applied in the field of microwave vacuum electronic devices, can solve problems such as difficult assembly, poor product consistency, and low difficulty in process implementation

Active Publication Date: 2021-07-06
NO 12 RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The first object of the present invention is to provide a cathode heating subassembly, which has an integrated and stable structure, low difficulty in process implementation, and overcomes the difficulty in assembling various parts of the existing indirect heating cathode. Poor product consistency and low production efficiency

Method used

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  • A cathode heating subassembly and its manufacturing method
  • A cathode heating subassembly and its manufacturing method

Examples

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Embodiment 1

[0060] A manufacturing method of a cathode heating subassembly:

[0061] Input the 3D model file into the SLM equipment for layered and discrete data processing, and irradiate the molten tungsten powder with laser to accumulate accurately from bottom to top:

[0062] The bottom layer is the porous emitter 1 of the cathode emitter, and the density is controlled at about 75% of the theoretical density of pure tungsten, and then a dense layer 2 is piled up on it, and the density reaches more than 90% of the theoretical density of pure tungsten;

[0063] Continue to pile up the support body 3, the support body 3 is an array of slanted columns and straight columns, which are directly accumulated and grown on the dense layer 2; the top surface of each column of the support body 3 is divided into two short slanted columns, and continue to pile up to form heat particles The column array of the heating element 4, the top of each column is fused with the adjacent column through oblique ...

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Abstract

The invention discloses a cathode heating subassembly, which comprises a porous emitter integrally formed by using tungsten powder as a raw material by selective laser melting technology, a dense layer covering the porous emitter, and a The thermon heating body above the dense layer and the thermon potential drawing structure above the thermon heating body. The cathode thermal subassembly has an integrated stable structure and is easy to prepare and obtain. The invention also discloses a manufacturing method of the cathode heating subassembly.

Description

technical field [0001] The invention relates to the field of microwave vacuum electronic devices. More specifically, it relates to a cathode thermal subassembly and a manufacturing method thereof. Background technique [0002] The cathode is the electron source of the electric vacuum device and the core component of the device. Hot cathode is the most widely used type of cathode in electric vacuum devices. It relies on heat energy to make electrons in the cathode escape from the surface to generate electron emission. According to different heating methods, hot cathodes can be divided into two types: direct heating type and indirect heating type. The application of indirect heating cathodes is more extensive and there are more development categories. [0003] The indirect heating cathode needs the heater to heat the cathode emitter, that is, the work of electron emission and electric heating is completed by an independent cathode emitter and the heater component, so that im...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J1/22H01J9/04
CPCH01J1/22H01J9/04
Inventor 孙信邵文生于志强张珂
Owner NO 12 RES INST OF CETC
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