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Photosensitive module and manufacturing method thereof

A technology of photosensitive components and manufacturing methods, which is applied in the field of optics to meet the needs of miniaturization, reduce size, and avoid damage or pollution

Active Publication Date: 2019-07-05
NINGBO SUNNY OPOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the camera module industry is becoming more and more miniaturized, the size of the circuit board (such as a printed circuit board) itself is close to the limit it can achieve, and can no longer meet the needs of more miniaturization

Method used

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  • Photosensitive module and manufacturing method thereof
  • Photosensitive module and manufacturing method thereof
  • Photosensitive module and manufacturing method thereof

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Embodiment Construction

[0068] For a better understanding of the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are descriptions of exemplary embodiments of the application only, and are not intended to limit the scope of the application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0069] It should be noted that in this specification, expressions of first, second, etc. are only used to distinguish one feature from another, and do not represent any limitation on the features. Accordingly, a first body discussed hereinafter may also be referred to as a second body without departing from the teachings of the present application.

[0070] In the drawings, the thickness, size and shape of objects have been slight...

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Abstract

The invention provides a photosensitive module. The photosensitive module comprises: a photosensitive chip having a first surface having a photosensitive region, a second surface back to the first surface and a liner; electronic elements arranged around the photosensitive chip; molding portions arranged around the photosensitive chip and combined with the photosensitive chip; and a first re-wiringlayer covering at least part of the surface of the photosensitive chip and at least part of the surface of the molding portion, wherein the liner is electrically connected with the first re-wiring layer through the electronic elements. The present invention further provides a corresponding manufacturing method of a photosensitive module. The circuit board can be cancelled to meet the mini-type demand; the yield and the product quality can be improved; the bonding of the silicon glass forms protection for the photosensitive chip, and glass having the protection effect can replace a traditionalcolor filter piece so as to further reduce the size of the photosensitive module or a camera module.

Description

technical field [0001] The invention relates to the field of optical technology, in particular, the invention relates to a photosensitive component and a manufacturing method thereof. Background technique [0002] With the continuous development of smart devices, the requirements for camera modules are getting higher and higher. At present, the camera module industry is becoming more and more miniaturized to meet the requirements of integration and miniaturization of smart terminals (such as smart phones). [0003] Existing camera modules are usually assembled from a photosensitive component and a lens component. The photosensitive component usually mainly includes a photosensitive chip and a circuit board (such as a printed circuit board). The photosensitive chip is used to convert the received light signal into an electrical signal to obtain image data. On the one hand, the circuit board can be used as the substrate for installing the photosensitive chip, and on the oth...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146
CPCH01L27/14634H01L27/14636H01L27/1469
Inventor 王明珠赵波杰田中武彦郭楠陈振宇
Owner NINGBO SUNNY OPOTECH CO LTD
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