Image sensor module and camera module including same

Abstract

Provided are an image sensor module and a camera module including the same. The image sensor module includes a printed circuit board having accommodation space for insertion of an image sensor; a bonding material continuously covering the image sensor and the printed circuit board; and an infrared ray (IR) filter bonded to the image sensor through a bonding material. A gap is formed between the IR filter and the image sensor, so the image sensor module meets the miniaturization requirement and has improved stiffness.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2016-0009458 filed in the Korean Intellectual Property Office on Jan. 26, 2016, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The present disclosure relates to an image sensor module and a camera module including the image sensor module. Background technique [0003] In general, camera modules have been applied to various information technology (IT) devices such as portable communication devices, and according to the recent trend of miniaturization of these portable communication devices, miniaturization of the camera module itself is required. [0004] In the camera module, an image of a subject may be captured by an image sensor such as a Charge Coupled Device (CCD), Complementary Metal Oxide Semiconductor (CMOS), etc. to be stored as data in a memory of the device. For this, an image sensor is mounted on a substrate, and bond...

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Problems solved by technology

[0005] However, in general, in the case where the image sensor is mounted on the upper surface of the substrate, the overall size of the camera module may be increased due to the space occupied by the image sensor

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