Image sensor module and camera module including same

An image sensor and camera module technology, applied in image communication, color TV parts, TV system parts, etc., can solve the problem of increasing the overall size of the camera module

Active Publication Date: 2017-08-01
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in general, in the case where the image sensor is mounted on the upper surface of the substrate, the overall size of the camera module may be increased due to the space occupied by the image sensor

Method used

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  • Image sensor module and camera module including same
  • Image sensor module and camera module including same
  • Image sensor module and camera module including same

Examples

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Embodiment Construction

[0015] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0016] Terms regarding directions will be described. The optical direction refers to a direction from the lens barrel 21 to the image sensor 51 or a direction from the image sensor 51 to the lens barrel 21 .

[0017] figure 1 is a schematic cross-sectional view of a camera module according to an exemplary embodiment of the present disclosure.

[0018] refer to figure 1 , the camera module according to an exemplary embodiment of the present disclosure may include a lens module 20, an actuator 40 that moves the lens module 20, an image sensor module 50 that converts light incident through the lens barrel 21 into an electrical signal, and converts the lens The housing 30 and the housing 10 in which the module 20 and the actuator 40 are housed.

[0019] The lens module 20 may include a lens barrel 21 and a carrier 23 coupled to the lens...

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Abstract

Provided are an image sensor module and a camera module including the same. The image sensor module includes a printed circuit board having accommodation space for insertion of an image sensor; a bonding material continuously covering the image sensor and the printed circuit board; and an infrared ray (IR) filter bonded to the image sensor through a bonding material. A gap is formed between the IR filter and the image sensor, so the image sensor module meets the miniaturization requirement and has improved stiffness.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2016-0009458 filed in the Korean Intellectual Property Office on Jan. 26, 2016, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The present disclosure relates to an image sensor module and a camera module including the image sensor module. Background technique [0003] In general, camera modules have been applied to various information technology (IT) devices such as portable communication devices, and according to the recent trend of miniaturization of these portable communication devices, miniaturization of the camera module itself is required. [0004] In the camera module, an image of a subject may be captured by an image sensor such as a Charge Coupled Device (CCD), Complementary Metal Oxide Semiconductor (CMOS), etc. to be stored as data in a memory of the device. For this, an image sensor is mounted on a substrate, and bond...

Claims

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Application Information

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IPC IPC(8): H04N5/225
CPCH04N23/54H04N23/57H04N23/55
Inventor 矢嶋淳史
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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