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Array antenna based on substrate integration waveguides

A substrate-integrated waveguide and array antenna technology, applied in the field of communications, can solve the problem that the antenna bandwidth is not wide enough, etc.

Active Publication Date: 2019-07-05
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the size of each antenna element of this antenna is the same, the bandwidth of the antenna is still not wide enough

Method used

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  • Array antenna based on substrate integration waveguides
  • Array antenna based on substrate integration waveguides
  • Array antenna based on substrate integration waveguides

Examples

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Embodiment Construction

[0073] The patch array antenna based on the substrate-integrated waveguide provided in the embodiment of the present application can be applied to a wireless communication device for sending, receiving and transmitting wireless communication signals. The wireless communication device is, for example, a communication base station.

[0074] figure 1 An exploded schematic diagram of an array antenna based on a substrate integrated beam provided by an embodiment of the present application, figure 2 A schematic top view of an array antenna based on a substrate integrated beam provided by an embodiment of the present application; image 3 A schematic side view of an array antenna based on a substrate integrated beam provided for an embodiment of the present application; as Figure 1-Figure 3 As shown, the substrate integrated beam-based array antenna 100 of this embodiment includes a first dielectric plate 110 and a second dielectric plate 120, and the second dielectric plate 120 ...

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Abstract

The embodiment of the present invention provides an array antenna based on substrate integration waveguides. The array antenna comprises a first dielectric plate and a second dielectric plate locatedat the upper portion of the first dielectric plate; the first dielectric plate is a substrate integration waveguide provided with two rows of metalized through holes in a vertical direction; the second dielectric plate is provided with a N radiation patches arranged in an array mode, the N radiation patches are located between the two rows of metalized through holes, and N grooves are etched at the upper surface of the first dielectric plate, and the N radiation patches are located at the upper portions of the N grooves in the one-to-one correspondence mode; the second dielectric plate is provided with holes communicating with the two rows of metalized through holes; and the array antenna meets the at least one condition that: the size of the at least one radiation patch is not different,the size of the at least one groove is different, and the relative position between the at least one radiation patch and the corresponding groove is different. Therefore, the N radiation units are notall the same so as to reduce the bandwidth of the array antenna.

Description

technical field [0001] The embodiments of the present application relate to the field of communication technologies, and in particular to an array antenna based on a substrate integrated waveguide. Background technique [0002] Substrate Integrated Waveguide (SIW) has the advantages of low insertion loss, high quality factor, high power capacity, etc., and its production cost and design complexity have unparalleled advantages in microwave and millimeter wave frequency bands. Therefore, SIW Applied in the field of antennas, the planarization and miniaturization of the antenna can be realized, and the integrated integration of the antenna and the circuit can be realized. At present, there is a patch array antenna fed in series, which is a low-cost, high-gain and high-efficiency antenna. It is a microstrip patch antenna fed by a substrate integrated waveguide. The feed network of the array is The antenna is fed in series first, and then combined with a power divider in the for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q21/00H01Q1/38H01Q1/50
CPCH01Q1/38H01Q1/50H01Q21/005
Inventor 张关喜张盛强沈龙兰江宏
Owner HUAWEI TECH CO LTD
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