Manufacturing method of thin film touch sensor and thin film touch sensor
A technology of touch sensing and manufacturing methods, which is applied in the input/output process of instruments, data processing, calculation, etc., and can solve the problems of stacking offset of each layer, small stacking offset of lines, and low efficiency of exposure alignment , to achieve the effects of small line stack offset, precise exposure alignment, stable and controllable shape and size changes
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0068] A manufacturing method of a thin film touch sensor, comprising the following steps:
[0069] (a) Bake the rigid carrier covered with the film substrate, the baking temperature is 130°C, and the baking time is 60min; wherein the film substrate is a PET film substrate, the rigid carrier is a glass plate, and the film substrate The adhesive between the material and the rigid carrier is acrylic adhesive;
[0070] (b) Making multi-layer touch circuits:
[0071] The first ITO coating;
[0072] The first ITO line process: photoresist coating, soft baking, exposure, development, hard baking, etching and stripping photoresist, the soft baking temperature is 110 ℃, after baking, let it stand for 3 minutes, and the exposure table temperature is controlled at 25 ℃;
[0073] The first OC line process: OC photoresist coating, soft baking, exposure, development and solid baking, the soft baking temperature is 110 ° C, the soft baking time is 3 minutes, after baking, let stand for 3 ...
Embodiment 2
[0081] A manufacturing method of a thin-film touch sensor is different from Embodiment 1 in that the baking temperature is 140° C., the baking time is 40 minutes, and other steps and parameters are the same as those in Embodiment 1.
Embodiment 3
[0083] A manufacturing method of a thin-film touch sensor is different from Embodiment 1 in that the baking temperature is 120° C., the baking time is 60 minutes, and other steps and parameters are the same as those in Embodiment 1.
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
elastic modulus | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com