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Method for extracting heat production time of a metal structure of a metal insulating layer

A metal structure, metal insulation technology, used in static memory, instruments, etc., can solve the problems of magnetic moment reversal of the storage layer, loss of information, easy breakage of the valence bond of the insulating layer, etc., to achieve accurate heat generation time constant and improve reliability. , the effect of high robustness

Active Publication Date: 2019-07-09
ZHEJIANG UNIV +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For example, according to the Arrhenius equation, when the temperature is higher, the valence bonds of the insulating layer are more likely to be broken, so the probability of failure due to breakdown will increase
In addition, for the magnetic tunnel junction, higher temperature will cause the magnetic moment of the storage layer to flip, resulting in the loss of the stored information

Method used

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  • Method for extracting heat production time of a metal structure of a metal insulating layer
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  • Method for extracting heat production time of a metal structure of a metal insulating layer

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Embodiment Construction

[0022] In the following detailed description, reference is made to the accompanying drawings which form a part hereof, and which show by way of illustration specific embodiments in which the invention may be practiced. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. For example, features illustrated or described with respect to one embodiment can be used or combined with other embodiments to yield a still further embodiment. It is intended that the present invention include such modifications and variations. The embodiments are described using specific language which should not be construed as limiting the scope of the appending claims. The drawings are not drawn to scale and are for illustration purposes only.

[0023] A method for extracting heat generation time of a metal structure of a metal insulating layer proposed by the present invention, said method...

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Abstract

The invention discloses a method for extracting heat production time of a metal structure of a metal insulating layer. By using the ultrafast voltage pulse, a device can generate intrinsic electric breakdown. By changing the pulse time width, the temperature of the device in the breakdown process can be adjusted, and thermal breakdown of the device occurs. The result of the ultrafast pulse is compared with the result of the low-speed pulse, and an inflection point is recorded in the relationship between the breakdown voltage and the pulse width as a heat production time constant of the device.The method is based on the occurrence mechanism of breakdown, so that the method is insensitive to various parasitic effects and has high robustness. According to the method, a relatively accurate heat generation time constant can be obtained, and thermal simulation in circuit design is facilitated, so that the reliability of the circuit is improved.

Description

technical field [0001] The invention belongs to the field of semiconductor device testing, and in particular relates to a method for extracting heat generation time of a metal structure of a metal insulating layer. Background technique [0002] A metal-insulator-metal (MIM) structure is a common circuit device, such as a metal-oxide-semiconductor (MOS) structure, and a magnetic tunnel junction (MTJ). When the thickness of the insulating layer is extremely small, due to the tunneling effect, when a voltage is applied, considerable current flows through the metal insulating layer metal structure. This current will generate heat during the operating time of the device, causing the temperature of the device to be much higher than the ambient temperature in which the device is located. Since electron scattering mainly occurs at the interface between the insulating layer and the metal, this interface is the main heat source. At the same time, the thermal conductivity of the insu...

Claims

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Application Information

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IPC IPC(8): G11C29/50
CPCG11C29/50004G11C2029/5004
Inventor 赵毅高世凡陈冰
Owner ZHEJIANG UNIV
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