Touch film element perforated conductive structure and method

Abstract

A perforated conductive structure of a touch film element, comprising: a film touch element and a flexible circuit board; wherein, a plurality of conductive circuit layers are arranged on the film touch element, and an axial perforation is arranged on the film touch element A conductive glue is arranged in the axial through hole by dispensing glue, and the conductive glue fills the aperture of the axial through hole, so that the conductive circuit layers of the thin film touch element are connected to each other through the contact of the conductive glue; The flexible circuit board is connected to one of the plurality of conductive circuit layers of the film touch element, and is connected in series with each conductive circuit layer through the conductive glue. The invention further discloses a method for through-hole conduction of the touch film element. With the above structure and method, the perforated conductive structure of the touch film element of the present invention can effectively control the shape of the conductive glue when the conductive glue is applied, so that the conductive circuit layers can be connected to each other through the contact of the conductive glue.

Description

technical field [0001] The invention relates to a perforated conductive structure and method of a touch film element, in particular to a conductive perforated technology to reduce the volume of a flexible circuit board and meet the requirement of an extremely narrow frame. Background technique [0002] Press, the current connection design method of the conductive line layer in the frame of the mobile phone, please refer to figure 1 As shown, a flexible circuit board 10 is used as the connection between the conductive circuit layer 21 and the layer 22 of a thin film touch element 20, but the flexible circuit board 10 occupies a certain volume, and in recent years due to the extremely narrow frame of the touch panel 2 The increase in demand makes the viewing area larger, and the current design of the flexible circuit board 10 may not be able to meet the requirements of the appearance design of the extremely narrow frame. [0003] Therefore, the conductive circuit layers 21, 2...

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Problems solved by technology

[0005] However, the conductive adhesive 23 needs to be heated and cured to produce conductivity and adhesion, and the heat curing time usually takes more than 30 minutes. During the heat curing period, the viscosity of the conductive adhesive 23 will first become thinner and then change due to high temperature. Due to the sticky situation, the shape of the conductive adhesive 23 cannot be effectively controlled, so that the conductive adhesive 23 may not be able to effectively contact the conductive circuit layers 21, 22 of the thin film touch element 20, so that the conductive circuit layers 21, 22 are connected to each other. conduction, making the process parameters difficult to control (as shown in Figure 3)

[0006] It can be seen that there are still many deficiencies in the above-mentioned customary items, which are not a good designer and need to be improved urgently.

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