Semiconductor laser and laser chip

Abstract

The invention discloses a semiconductor laser and a laser chip. The semiconductor laser is used for adjusting width of a transition heat sink according to temperature distribution on a resonant cavityof the laser chip, so that the temperature is uniformly distributed along a direction from a front cavity surface to a rear cavity surface of the resonant cavity. In the laser chip, the influence brought by thermal crosstalk phenomenon between ridge-shaped waveguide structures is reduced by adjusting the width of each ridge-shaped waveguide structure and the distance between the ridge-shaped waveguide structures according to the temperature distribution of the positions where a plurality of ridge-shaped waveguide structures are located, so that the temperature of each ridge-shaped waveguide structure is maintained similar, the stability of the semiconductor laser and the laser chip is improved, and the service lifetime of the semiconductor laser and the laser chip is prolonged.

Description

technical field [0001] The invention relates to the technical field of lasers, in particular to a semiconductor laser and a laser chip. Background technique [0002] Since TO packaging technology is used to package lasers, it has the advantages of small parasitic parameters, simple process, low cost and convenient use, so TO packaging technology has been widely used in the field of laser packaging. However, lasers packaged in TO often have the following problems: Compared with the front cavity surface of the laser resonator, the rear cavity surface of the laser resonator is closer to the heat dissipation surface of the laser, which leads to the front cavity of the laser along the direction of the resonator The phenomenon that the temperature of the cavity surface is high and the temperature of the cavity surface is low, this uneven temperature distribution will affect the stability of the laser. [0003] In order to increase the output power of the laser, a multi-ridge semi...

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Problems solved by technology

However, lasers packaged in TO often have the following problems: Compared with the front cavity surface of the laser resonator, the rear cavity surface of the laser resonator is closer to the heat dissipation surface of the laser, which leads to the front cavity of the laser along the direction of the resonator The phenomenon that the temperature of the cavity surface is high and the temperature of the cavity surface is low, this uneven temperature distribution will affect the stability of the laser

[0003] In order to increase the output power of the laser, a multi-ridge semiconductor laser is often formed by setting a plurality of ridge waveguide structures arranged in an array, but this multi-ridge semiconductor laser will cause thermal crosstalk between each ridge waveguide structure. , causing the temperature of the laser chip to show that the center of the chip has a high temperature, while the edge of the chip has a low temperature, which seriously affects the output wavelength of the laser, affects the stability of the laser, and reduces its service life.

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